{"name":"口腔义齿制作专项职业能力题库","level":"不分级","org":"人力资源和社会保障部门","count":300,"questions":[{"id":1,"type":"single","stem":"在可摘局部义齿制作中，模型设计时填倒凹使用的材料应具备的主要性能是","options":["能牢固粘接在石膏模型表面且便于后续修整","能渗入石膏微孔以增强模型强度","能在蜡型表面形成光滑隔离层","能溶解模型表面的分离剂残留"],"answer":[0],"explanation":"填倒凹材料需临时固定在石膏模型上，封闭倒凹，且修整方便。它能渗入石膏微孔以增强模型强度是石膏硬化材料的性能；在蜡型表面形成光滑隔离层是分离剂的作用；溶解模型表面分离剂残留与填倒凹无关。","tier":"进阶"},{"id":2,"type":"single","stem":"制作钴铬合金铸造支架时，模型上设计网状连接体的主要作用是","options":["分散咬合力并防止基托折断","补偿铸造合金的冷却收缩","增加支架与模型之间的间隙","便于义齿完成后从模型上取下"],"answer":[0],"explanation":"网状连接体位于基托区域，用于传递和分散咬合力，增强基托抗折能力。补偿冷却收缩靠铸造收缩补偿；支架与模型间隙由间隙涂料控制；便于从模型取下与模型分离设计有关。","tier":"基础"},{"id":3,"type":"single","stem":"在热凝树脂基托聚合过程中，将调和好的树脂填入型盒后加压，其直接目的是","options":["使树脂充分渗入石膏模型微孔","排出多余树脂并减少气泡","提高树脂与人工牙的化学结合力","加速树脂的放热反应速度"],"answer":[1],"explanation":"加压可使多余树脂溢出，减少气泡和缺陷。树脂不会渗入石膏微孔；化学结合力由单体溶胀人工牙表面形成；放热反应速度由聚合温度和时间控制，与加压无直接关系。","tier":"进阶"},{"id":4,"type":"single","stem":"铸造蜡型在安插铸造时，铸道与蜡型主体连接处应","options":["形成圆钝过渡且避免形成锐角","尽量细窄以减少金属用量","垂直插入蜡型最厚处","直接接在蜡型最薄边缘上"],"answer":[0],"explanation":"圆钝过渡有利于金属液平稳充填，避免湍流和铸造缺陷。细窄铸道会影响充填；垂直插入最厚处可能造成局部过热；接在最薄边缘易导致边缘缺损。","tier":"基础"},{"id":5,"type":"single","stem":"全口义齿制作中，确定后牙牙尖斜度的主要依据是","options":["患者面型与牙弓宽度","患者年龄与性别","患者髁道斜度与切道斜度","患者牙槽嵴吸收程度"],"answer":[2],"explanation":"后牙牙尖斜度应与髁道斜度和切道斜度相协调，以利于平衡𬌗。面型、牙弓宽度、年龄、性别、牙槽嵴吸收程度不直接决定牙尖斜度选择。","tier":"基础"},{"id":6,"type":"single","stem":"在弯制卡环时，不锈钢丝表面出现明显凹痕但未折断，该卡环继续使用会导致","options":["卡环弹性下降且易疲劳折断","卡环与基牙摩擦力增大","卡环颜色与基托不协调","卡环臂长度自动缩短"],"answer":[0],"explanation":"凹痕处产生应力集中和冷作硬化，弹性下降，易疲劳折断。摩擦力增大不是主要后果；颜色不协调与凹痕无关；卡环臂长度不会自动缩短。","tier":"进阶"},{"id":7,"type":"single","stem":"制作个别托盘时，在模型表面铺蜡或贴膜留出间隙的主要作用是","options":["补偿印模材料的厚度并容纳多余材料","防止托盘材料与模型粘连","提高托盘材料的固化速度","增加托盘与口腔黏膜的吸附力"],"answer":[0],"explanation":"预留间隙为印模材料提供空间，保证印模均匀、完整。防止粘连是分离剂作用；固化速度由材料本身决定；吸附力与托盘间隙无直接关系。","tier":"基础"},{"id":8,"type":"single","stem":"某技师在铸造钴铬合金支架后，发现铸件表面有较多圆形气孔，最可能的原因是","options":["铸造温度过高导致合金沸腾","铸圈焙烧温度不足或排气不畅","蜡型表面涂布分离剂过厚","铸道直径过大导致金属流速过快"],"answer":[1],"explanation":"铸圈焙烧不足或排气不畅会使气体无法排出，形成气孔。铸造温度过高多导致氧化和收缩；分离剂过厚影响表面粗糙度；铸道过大不是气孔主因。","tier":"挑战"},{"id":9,"type":"single","stem":"在热凝树脂基托热处理时，若升温过快，最可能出现的缺陷是","options":["基托出现气泡且颜色发白","基托与人工牙结合过紧","基托表面过于光滑","基托收缩率明显降低"],"answer":[0],"explanation":"升温过快使树脂外层先聚合，内部单体沸腾产生气泡，且放热集中导致颜色发白。结合过紧、表面光滑、收缩率降低均不是升温过快的典型后果。","tier":"基础"},{"id":10,"type":"single","stem":"某患者可摘局部义齿戴用后主诉基托边缘压痛点明确，技师在模型上检查发现该处有明显倒凹未填除，正确的处置是","options":["磨除基托对应边缘组织面","重新填除倒凹后重做基托","在基托边缘加厚缓冲","调磨对颌牙尖以减轻压力"],"answer":[0],"explanation":"明确压痛点且模型倒凹未填除，应先磨除基托对应部位组织面以缓解压迫。重做基托不是首选；加厚边缘会加重压迫；调磨对颌牙与基托压痛无关。","tier":"挑战"},{"id":11,"type":"single","stem":"在制作全口义齿蜡型时，技师发现下颌蜡堤唇侧丰满度不足，正确的处理是","options":["直接加蜡恢复唇侧丰满度并修整形态","降低下颌前牙排列位置","磨除上颌蜡堤唇侧对应区域","增加后牙牙尖高度以补偿"],"answer":[0],"explanation":"唇侧丰满度不足应在蜡型上加蜡恢复并修整。降低前牙位置、磨除上颌蜡堤、增加后牙牙尖高度均不能纠正唇侧丰满度不足。","tier":"挑战"},{"id":12,"type":"single","stem":"在制作钴铬合金铸造支架时，模型上的工作区与组织面倒凹区之间通常需要预留的缓冲间隙厚度约为多少毫米","options":["0.1～0.2","0.3～0.5","0.6～0.8","0.9～1.2"],"answer":[1],"explanation":"知识点：钴铬合金铸造支架组织面缓冲间隙。正确项：钴铬合金支架组织面需预留0.3～0.5mm缓冲间隙，以容纳印模材和石膏膨胀并保证就位。错误项：0.1～0.2mm过薄，铸件易压迫黏膜；0.6～0.8mm过厚，支架与组织不密贴、易翘动；0.9～1.2mm明显过大，影响固位和密合。","tier":"基础"},{"id":13,"type":"single","stem":"用自凝树脂修补热凝基托折裂处时，在断面涂单体后应采用的正确操作顺序是","options":["直接填自凝树脂并放入冷水加压","先填树脂再涂单体后放入温水","涂单体后待其溶胀再填树脂并加压","涂单体后立即用热吹风吹干再填树脂"],"answer":[2],"explanation":"知识点：自凝树脂修补基托的界面处理。正确项：涂单体使断面溶胀形成结合层后再填树脂，可获得较好粘结。错误项：直接填树脂未溶胀，结合差；先填后涂单体无法渗透界面；热吹风吹干会使单体挥发失去溶胀作用。","tier":"进阶"},{"id":14,"type":"single","stem":"某技师在制作全口义齿蜡型时发现人工牙排列后前牙覆盖过小，最应优先调整的是","options":["加高下前牙切缘","磨改上颌前牙唇面","调整下前牙唇舌向位置","重新制作上颌基托蜡型"],"answer":[2],"explanation":"知识点：全口义齿前牙覆盖的排牙调整。正确项：覆盖过小多由下前牙唇向位置不当所致，调整下前牙唇舌向位置最直接。错误项：加高切缘改变的是垂直向；磨改上牙唇面破坏外形且不解决覆盖；重做上颌蜡型不针对覆盖过小的原因。","tier":"挑战"},{"id":15,"type":"single","stem":"铸造蜡型在安插铸道时，对于上颌前牙单冠的铸道通常应安插在","options":["切端靠近唇面处","舌面近颈缘处","邻面接触点处","颈缘唇侧正中处"],"answer":[1],"explanation":"知识点：单冠铸道安插位置。正确项：前牙单冠铸道常安插在舌面近颈缘处，有利于熔金流入且不破坏唇面外形。错误项：切端靠近唇面会破坏美观面；邻面接触点处影响邻接关系；颈缘唇侧正中处易造成边缘缺陷。","tier":"基础"},{"id":16,"type":"single","stem":"在制作可摘局部义齿时，模型观测中确定就位道后，位于导线非倒凹区的基牙面通常用于","options":["放置卡环臂的弹性部分","放置支托和对抗臂","作为倒凹填除区","作为印模边缘整塑区"],"answer":[1],"explanation":"知识点：模型观测线与卡环设计。正确项：非倒凹区（导线以上）用于放置支托和对抗臂，起支持对抗作用。错误项：卡环弹性臂应位于倒凹区；倒凹填除针对的是倒凹区；边缘整塑是印模步骤与就位道无关。","tier":"进阶"},{"id":17,"type":"single","stem":"某加工厂在铸造纯钛支架时，使用的包埋材应首选","options":["石膏系包埋材","磷酸盐系包埋材","硅酸乙酯系包埋材","专用钛包埋材"],"answer":[3],"explanation":"知识点：纯钛铸造包埋材选择。正确项：纯钛化学活性高，需用专用钛包埋材以保证铸件质量。错误项：石膏系包埋材高温分解与钛反应；磷酸盐系包埋材膨胀和反应性不适合纯钛；硅酸乙酯系包埋材传统用于贵金属或钴铬，不适用于纯钛。","tier":"进阶"},{"id":18,"type":"single","stem":"在全口义齿制作中，蜡堤上划出的中线主要用于确定","options":["平面倾斜度","面部中线位置","垂直距离","后堤区范围"],"answer":[1],"explanation":"知识点：全口义齿蜡堤记录标志。正确项：中线用于确定面部中线，指导前牙排列。错误项：平面倾斜度靠蜡堤平面观察；垂直距离靠息止颌位测量；后堤区范围由模型后缘确定。","tier":"基础"},{"id":19,"type":"single","stem":"制作金属烤瓷冠时，金瓷结合面在回切前牙唇侧瓷空间时，通常唇侧应留出的瓷层厚度约为","options":["0.3～0.5mm","0.8～1.2mm","1.5～2.0mm","2.2～2.8mm"],"answer":[1],"explanation":"知识点：金属烤瓷冠瓷层厚度。正确项：唇侧瓷层通常需0.8～1.2mm以保证颜色和强度。错误项：0.3～0.5mm太薄遮色差；1.5～2.0mm过厚易崩瓷且牙体预备过多；2.2～2.8mm明显过大不现实。","tier":"基础"},{"id":20,"type":"single","stem":"某技师在完成钴铬合金支架电解抛光后，发现支架表面局部仍较粗糙，最恰当的处理是","options":["延长电解抛光时间至表面光滑","重新喷砂后再次电解抛光","用高速手机磨光后直接交付","降低电流密度重新电解抛光"],"answer":[1],"explanation":"知识点：钴铬支架电解抛光异常处理。正确项：局部粗糙多因表面氧化层或污染，应重新喷砂清洁后再电解抛光。错误项：单纯延长时间会造成过度腐蚀；直接磨光不解决电解不均；降低电流密度不能去除已形成的粗糙层。","tier":"挑战"},{"id":21,"type":"single","stem":"在制作可摘局部义齿时，患者模型上基牙向缺隙侧倾斜较大，为获得共同就位道，通常采取的措施是","options":["调磨基牙近缺隙侧倒凹","调磨基牙远缺隙侧倒凹","改变卡环类型为环形卡","增加基托面积"],"answer":[1],"explanation":"知识点：共同就位道的获得。正确项：基牙向缺隙侧倾斜时，调磨远缺隙侧倒凹有利于获得共同就位道。错误项：近缺隙侧调磨会破坏倒凹固位；环形卡不解决就位道问题；增加基托面积与就位道无关。","tier":"进阶"},{"id":22,"type":"single","stem":"某技师在制作全口义齿时，发现下颌模型舌侧翼缘区倒凹明显，正确的处理方式是","options":["直接在该区加压填蜡","用蜡填除倒凹并缓冲","磨除模型对应区域","忽略倒凹直接铺蜡"],"answer":[1],"explanation":"知识点：全口义齿模型倒凹处理。正确项：舌侧翼缘区倒凹应用蜡填除并缓冲，防止基托压迫。错误项：直接加压填蜡不解决倒凹；磨除模型会改变形态；忽略倒凹会导致基托就位困难或压痛。","tier":"挑战"},{"id":23,"type":"multi","stem":"在制作可摘局部义齿铸造支架时，下列哪些部位通常需要进行缓冲处理","options":["基牙舌侧倒凹区","骨隆突对应组织面","基托边缘封闭区","支托凹底面","缺隙区牙槽嵴顶"],"answer":[1,2],"explanation":"知识点：铸造支架缓冲部位。正确项：骨隆突对应组织面和基托边缘封闭区需缓冲，防止压痛和影响封闭。错误项：基牙舌侧倒凹区是卡环固位区不需缓冲；支托凹底面是支托就位区不需缓冲；缺隙区牙槽嵴顶为基托承托区一般不需缓冲。","tier":"挑战"},{"id":24,"type":"single","stem":"在石膏模型上制作熔模时，蜡型与模型之间涂分离剂的正确作用是","options":["防止蜡型粘在石膏表面影响取下","提高蜡型表面光洁度便于后续打磨","增强蜡型与石膏之间的结合强度","补偿铸件冷却后的收缩量"],"answer":[0],"explanation":"知识点是熔模制作中分离剂的作用。蜡型直接压贴在石膏模型上会嵌入石膏微孔，涂分离剂形成隔离膜便于完整取下蜡型，故A对；分离剂不改变蜡本身光洁度，B错；它降低而非增强结合，C错；收缩补偿靠蜡型放大或铸造补偿，与分离剂无关，D错。","tier":"基础"},{"id":25,"type":"single","stem":"制作钴铬合金支架时，模型上需要先填倒凹的区域是","options":["基牙邻面倒凹区","硬区缓冲部位","组织倒凹区","模型边缘封闭区"],"answer":[2],"explanation":"知识点是可摘局部义齿支架制作的填倒凹原则。组织倒凹区若不填除，支架就位时会压伤黏膜或无法就位，故C对；基牙邻面倒凹是卡环固位所需，不能填，A错；硬区缓冲是留出间隙而非填倒凹，B错；模型边缘封闭区是石膏模型处理，与填倒凹无关，D错。","tier":"基础"},{"id":26,"type":"single","stem":"全口义齿排牙时，前牙切导斜度偏大最可能导致","options":["前伸运动时后牙早接触","正中咬合时前牙无接触","侧方运动时尖牙保护丧失","息止间隙明显增大"],"answer":[0],"explanation":"知识点是前牙切导与后牙平衡咬合的关系。切导斜度偏大，前伸时前牙引导过陡，后牙易出现早接触，故A对；正中咬合时前牙接触与否取决于垂直覆盖，与切导斜度不成因果，B错；尖牙保护与侧方导有关，非前伸切导，C错；息止间隙由垂直距离决定，与切导斜度无关，D错。","tier":"基础"},{"id":27,"type":"single","stem":"某技师在铸造钴铬合金卡环时发现铸件表面出现较多小圆孔，最可能的原因是","options":["铸造温度过高导致合金氧化","铸圈内熔模未充分排气","包埋材料粉液比中液体偏多","铸道方向与离心力方向一致"],"answer":[1],"explanation":"知识点是铸造缺陷中气孔的形成。熔模未充分排气，浇铸时气体卷入合金形成圆孔，故B对；温度过高主要引起氧化和晶粒粗大，A错；粉液比液体偏多会使包埋材料强度下降、膨胀改变，不直接产生圆孔，C错；铸道与离心力方向一致是正确做法，D错。","tier":"挑战"},{"id":28,"type":"single","stem":"可摘局部义齿的模型观测中，确定就位道的核心依据是","options":["基牙牙冠的轴面倒凹分布","患者主诉的咀嚼习惯","对颌牙列的磨耗程度","旧义齿的使用年限"],"answer":[0],"explanation":"知识点是模型观测与就位道选择。就位道要使各基牙倒凹分布合理、卡环固位臂能进入适当倒凹，故A对；咀嚼习惯影响咬合设计但不决定就位道，B错；对颌磨耗与就位道无直接关系，C错；旧义齿年限与就位道设计无关，D错。","tier":"基础"},{"id":29,"type":"single","stem":"在弯制不锈钢丝卡环时，为防止钢丝表面出现裂纹，正确的操作是","options":["在弯制点反复来回弯折整形","用钳喙夹紧后快速大角度弯制","缓慢均匀用力并减少反复弯折","先加热钢丝至发红再弯制"],"answer":[2],"explanation":"知识点是金属丝冷弯的加工硬化特性。缓慢均匀用力、减少反复弯折可避免应力集中开裂，故C对；反复来回弯折会加工硬化致裂，A错；快速大角度弯制易使局部应力过大，B错；不锈钢丝加热发红会改变性能，不宜如此操作，D错。","tier":"基础"},{"id":30,"type":"single","stem":"全口义齿基托蜡型在装盒时，分离剂涂布不当最可能造成","options":["基托与石膏模型粘接难以分离","基托颜色出现深浅不均","基托内气泡明显增多","基托边缘伸展过长"],"answer":[0],"explanation":"知识点是装盒时分离剂的作用。分离剂涂布不当会使基托树脂与石膏模型粘连，开盒时难以分离甚至损坏模型，故A对；颜色不均与颜料和树脂混合有关，B错；气泡多与填胶压力、树脂稠度有关，C错；边缘伸展由蜡型边缘决定，D错。","tier":"基础"},{"id":31,"type":"single","stem":"某技师热处理全口义齿基托树脂后，开盒发现基托内布满细小气泡，下列最可能的原因是","options":["填胶时树脂量过多导致压力不足","热处理升温速度过慢","石膏模型未涂分离剂","树脂粉液比中粉偏多"],"answer":[0],"explanation":"知识点是基托树脂气泡缺陷。填胶量过多会使上下型盒无法压紧，树脂内部产生气泡，故A对；升温过慢一般减少气泡，B错；未涂分离剂引起粘连而非气泡，C错；粉偏多使树脂稠、流动性差，常致充填不全而非细小气泡，D错。","tier":"挑战"},{"id":32,"type":"single","stem":"某患者戴用新制作的可摘局部义齿后主诉基牙酸痛，检查发现卡环固位臂末端进入基牙倒凹过深，正确的处理是","options":["调磨基牙倒凹使卡环臂放松","调整卡环固位臂减少进入倒凹深度","加高基托边缘以分散咬合力","降低支托高度减少基牙受力"],"answer":[1],"explanation":"情境案例考点是卡环固位臂进入倒凹过深导致基牙受力过大。正确处置是调整卡环臂减少倒凹深度，故B对；调磨基牙不可逆且损伤牙体，A错；加高基托边缘与卡环固位无关，C错；支托高度不是主因，降低支托不能解决倒凹过深，D错。","tier":"挑战"},{"id":33,"type":"single","stem":"制作全口义齿个别托盘时，托盘边缘应比功能整塑后的边缘短约","options":["1mm","2mm","4mm","8mm"],"answer":[2],"explanation":"知识点是个别托盘边缘预留量。个别托盘边缘需比最终功能边缘短约4mm，为边缘整塑材料留出空间，故C对；1mm和2mm预留不足，整塑材料易溢出，A和B错；8mm预留过多会影响边缘整塑准确性，D错。","tier":"基础"},{"id":34,"type":"single","stem":"在焊接可摘局部义齿支架时，为防止焊接区变形，正确的做法是","options":["先固定一端再逐段连续焊接","将焊件整体预热后一次焊满","用石膏或固定剂包埋非焊接区","加大焊枪火焰使焊接快速完成"],"answer":[2],"explanation":"知识点是支架焊接的变形控制。包埋非焊接区可固定位置、减少热变形，故C对；逐段连续焊接会累积热量致变形，A错；整体预热后一次焊满易使支架整体软化变形，B错；火焰过大使局部过热变形，D错。","tier":"挑战"},{"id":35,"type":"single","stem":"铸造钴铬合金支架蜡型在安插铸造时，主铸道的储金球应设置在什么位置","options":["紧靠蜡型最厚处并留出2mm间隙","距离蜡型3~5mm的铸道中段","铸道与铸圈内壁接触处","铸道最末端靠近铸圈口处"],"answer":[0],"explanation":"知识点：储金球位置影响金属补缩。正确项紧靠蜡型最厚处并留出间隙，能形成最后凝固的金属液库补缩；距蜡型3~5mm中段补缩路径过长；铸道与铸圈内壁接触处无法形成有效补缩；铸道最末端远离蜡型起不到补缩作用。","tier":"进阶"},{"id":36,"type":"single","stem":"制作可摘局部义齿时，模型上填倒凹的目的是","options":["消除基托进入倒凹区的可能","增加基托与黏膜的密合度","补偿石膏凝固时的膨胀量","预留基托材料的收缩空间"],"answer":[0],"explanation":"知识点：填倒凹是防止义齿就位时基托硬性压入倒凹区。正确项消除基托进入倒凹可能；增加密合度靠模型准确；补偿石膏膨胀是模型灌注环节；预留收缩空间是树脂聚合收缩问题，与填倒凹无关。","tier":"基础"},{"id":37,"type":"single","stem":"固定桥制作中，代型修整时颈缘肩台处涂布间隙剂的主要作用是","options":["为粘接剂预留均匀的膜厚度","补偿铸造合金的收缩量","防止代型石膏吸水变形","增加基底冠与代型的摩擦固位"],"answer":[0],"explanation":"知识点：间隙剂为粘接剂提供空间。正确项预留粘接剂膜厚；补偿铸造收缩靠铸造补偿；防止石膏吸水与间隙剂无关；增加摩擦固位会阻碍就位，方向相反。","tier":"基础"},{"id":38,"type":"single","stem":"热凝树脂基托装盒后，充填树脂时下列哪种做法最可能导致基托出现气泡","options":["充填时树脂团揉捏后压入型盒","充填量略多于型盒所需","充填后加压时缓慢均匀施压","充填时在树脂表面滴少量单体"],"answer":[3],"explanation":"知识点：气泡来源包括单体过多、充填不足、压力不均。正确项滴加单体使局部单体过量，聚合时挥发形成气泡；揉捏压入是规范操作；略多于所需保证充盈；缓慢均匀加压是正确手法。","tier":"进阶"},{"id":39,"type":"single","stem":"制作全口义齿个别托盘时，托盘边缘应比印模区黏膜转折处短多少","options":["1~2mm","3~4mm","5~6mm","8~10mm"],"answer":[0],"explanation":"知识点：个别托盘边缘需短于前庭沟底1~2mm，为印模材料留出边缘整塑空间。3~4mm过短导致边缘不清；5~6mm和8~10mm明显过短，印模边缘无法达到功能整塑要求。","tier":"基础"},{"id":40,"type":"single","stem":"某技师在打磨钴铬合金支架时发现铸件表面出现密集小气孔，下列哪项最可能是造成该缺陷的直接原因","options":["铸造时铸圈温度偏低","合金熔炼时未加熔媒","铸圈内壁涂布了过多脱模剂","包埋时石膏粉液比中液体偏多"],"answer":[3],"explanation":"知识点：包埋料液粉比偏高会使包埋料透气性下降、强度降低，铸件易产生气孔。正确项液体偏多导致气孔；铸圈温度偏低致铸造不全而非气孔；未加熔媒影响熔炼质量；脱模剂过多影响包埋料结合但非气孔主因。","tier":"挑战"},{"id":41,"type":"single","stem":"某患者上颌单侧游离缺失，技师制作可摘局部义齿时在游离端基托组织面设计了缓冲区，其主要目的是","options":["减少基托对牙槽嵴的压应力","增加基托与黏膜的吸附力","便于患者自行摘戴义齿","防止基托树脂聚合时变形"],"answer":[0],"explanation":"知识点：游离端基托需缓冲以分散咬合力。正确项减少压应力；增加吸附力靠边缘封闭；便于摘戴靠卡环设计；防止树脂变形靠装盒方法，与缓冲区无关。","tier":"挑战"},{"id":42,"type":"single","stem":"制作嵌体蜡型时，蜡型从代型上取下后边缘出现变形，最可能的原因是","options":["蜡型厚度不足","蜡型未完全冷却就取下","代型表面未涂分离剂","蜡型边缘未加压密贴"],"answer":[1],"explanation":"知识点：蜡型需充分冷却硬化后再取下。正确项未冷却取下导致变形；厚度不足影响强度但非取下变形主因；未涂分离剂致取下困难；边缘未加压密贴影响边缘精度而非整体变形。","tier":"进阶"},{"id":43,"type":"single","stem":"某技师在制作铸造金属全冠时，发现冠边缘与代型肩台之间存在明显缝隙，下列哪项最不可能是造成该缝隙的原因","options":["蜡型边缘未与代型肩台密贴","包埋时蜡型边缘被包埋料覆盖","铸造时合金收缩未补偿","代型肩台处涂布了过多间隙剂"],"answer":[2],"explanation":"知识点：铸造收缩通过包埋料膨胀补偿，正常操作下不会造成边缘缝隙。正确项铸造收缩未补偿会影响整体密合但边缘缝隙更直接源于蜡型或包埋；蜡型未密贴直接致缝；包埋料覆盖边缘致铸造缺陷；间隙剂过多致就位后缝隙。","tier":"挑战"},{"id":44,"type":"single","stem":"活动义齿卡环臂进入倒凹的深度通常应控制在","options":["0.25mm左右","0.75mm左右","1.25mm左右","1.75mm左右"],"answer":[0],"explanation":"知识点：钴铬合金卡环臂弹性好，倒凹深度一般0.25mm左右。0.75mm过深会使卡环臂变形过大、患者摘戴困难；1.25mm和1.75mm明显过深，超出合金弹性范围。","tier":"基础"},{"id":45,"type":"multi","stem":"制作热凝树脂基托时，下列哪些操作有助于减少基托内气泡的产生","options":["充填树脂时采用揉捏法排除气泡","充填后采用缓慢均匀加压","装盒时石膏完全填满型盒底部","充填树脂前将型盒内壁涂分离剂"],"answer":[0,1],"explanation":"知识点：减少气泡的关键是排除树脂内气体和均匀加压。正确项揉捏法排气和缓慢均匀加压均减少气泡；石膏填满型盒底部是装盒要求，与气泡无直接关系；涂分离剂便于开盒，不影响基托内气泡。","tier":"挑战"},{"id":46,"type":"single","stem":"在制作钴铬合金铸造卡环时，若卡环臂进入倒凹区的深度为0.25mm，而该合金的弹性模量较高，通常应将卡环臂厚度控制在哪个范围较为适宜","options":["0.8mm至1.0mm","1.2mm至1.5mm","1.8mm至2.0mm","2.5mm至3.0mm"],"answer":[0],"explanation":"知识点：铸造卡环的厚度与弹性模量、倒凹深度的匹配关系。钴铬合金弹性模量高，刚性大，若厚度过大则进入0.25mm倒凹时对基牙的侧向力会显著增加，因此通常控制在0.8mm至1.0mm。错误项1.2mm至1.5mm：该范围更适合弹性模量较低的金合金卡环；错误项1.8mm至2.0mm：此厚度用于大连接体或支托等非弹性部件；错误项2.5mm至3.0mm：属于基托或支架主连接体的厚度范围。","tier":"进阶"},{"id":47,"type":"single","stem":"用蜡型制作全口义齿基托时，在模型上完成蜡基托铺垫后，为补偿树脂聚合收缩并保证基托与组织面密合，装盒前对蜡基托边缘通常应做以下哪项处理","options":["将蜡基托边缘修整至与模型边缘平齐并封闭","将蜡基托边缘加厚并超出模型边缘2mm","在蜡基托边缘每隔5mm烫出小孔","将蜡基托边缘用蜡条加高形成围堤"],"answer":[0],"explanation":"知识点：全口义齿蜡基托在装盒前的边缘处理要求。蜡基托边缘应与模型边缘平齐并封闭，以保证石膏包埋后形成完整的型腔，避免树脂从边缘溢出形成飞边或边缘缺损。错误项加厚并超出模型边缘2mm：会造成装盒后石膏与蜡之间形成倒凹，开盒时易撕裂石膏或使基托边缘过厚；错误项每隔5mm烫出小孔：小孔不能补偿收缩，反而会使石膏进入形成树脂突起；错误项用蜡条加高形成围堤：围堤用于防止印模材料外流，不是蜡基托装盒前的处理方式。","tier":"挑战"},{"id":48,"type":"single","stem":"某技师在制作上颌局部义齿时，发现模型上腭部有一处约3mm的孤立骨隆突，义齿基托在此处若直接压迫会导致戴牙后疼痛，以下处置中最符合临床可摘局部义齿设计原则的是","options":["在该处基托组织面做缓冲，使基托与骨隆突之间留出约0.5mm间隙","将该处基托边缘延长至骨隆突外侧以分散压力","在该处基托组织面加厚树脂以增加基托强度","将该处骨隆突在模型上刮除0.5mm后再制作基托"],"answer":[0],"explanation":"知识点：可摘局部义齿对骨隆突等硬区的缓冲处理。骨隆突处黏膜薄，义齿基托直接压迫会引起疼痛和黏膜溃疡，应在模型上相应部位用缓冲材料隔离，使基托组织面与骨隆突间留出约0.5mm间隙。错误项延长基托边缘至骨隆突外侧：会改变义齿边缘封闭，且不能解决局部压迫；错误项加厚树脂：加厚只会增加压迫，不能缓冲；错误项在模型上刮除骨隆突：模型是患者口腔的复制，刮除模型会使义齿与口腔实际形态不符，基托反而更压迫。","tier":"挑战"},{"id":49,"type":"single","stem":"在制作全口义齿时，技师发现上颌模型腭部正中有一条明显的腭中缝，若在此处不做处理直接铺蜡，最可能导致义齿戴用后出现哪种问题","options":["基托在此处与组织不密合，形成前后贯通的缝隙","基托在此处过厚，影响患者发音","基托在此处产生气泡，影响美观","基托在此处与对颌牙接触过紧，导致咬合升高"],"answer":[0],"explanation":"知识点：全口义齿基托对腭中缝等硬区的处理。腭中缝处黏膜薄，若模型上不做缓冲，基托在此处会先与组织接触，形成支点，导致基托前后翘动、与组织不密合，出现前后贯通的缝隙。错误项基托过厚影响发音：厚度问题与是否缓冲腭中缝无关；错误项产生气泡影响美观：气泡多因树脂填塞不当，与腭中缝解剖形态无直接关系；错误项与对颌牙接触过紧导致咬合升高：咬合升高与基托组织面缓冲无关。","tier":"挑战"},{"id":50,"type":"multi","stem":"在弯制活动义齿不锈钢卡环时，若发现卡环臂在模型上就位后与基牙轴面之间存在约0.3mm的均匀间隙，下列处置思路中符合卡环弯制工艺要求的有","options":["用弯制钳夹住卡环臂中段，向基牙方向缓慢施加轻微压力使其贴靠","在间隙处补少量自凝树脂后再将卡环臂压向基牙","退回弯制步骤，在卡环臂相应位置重新调整弯曲弧度后再就位","将卡环整体从模型上取下，用钳子把卡环臂末端直接夹拢收小"],"answer":[0,2],"explanation":"知识点：卡环弯制中卡环臂与基牙轴面的贴合调整。正确项0对，因为小间隙可通过在臂中段施加轻微压力进行弹性调整，使卡环臂贴靠基牙且不破坏卡环形态；正确项2对，因为间隙偏大或位置不当时应退回弯制步骤重新调整弧度，这是保证卡环弹性与就位方向的标准做法。错误项1错在卡环与基牙间不允许用自凝树脂填补，树脂会改变卡环弹性且易脱落；错误项3错在直接夹拢卡环臂末端会使卡环臂变形、丧失原有弹性，属于破坏性调整。","tier":"挑战"},{"id":51,"type":"single","stem":"在石膏模型上制作熔模时，蜡型边缘与代型颈缘的贴合要求是","options":["蜡型边缘略微超出颈缘线并加压修整","蜡型边缘与颈缘线平齐且光滑无飞边","蜡型边缘缩于颈缘线内约0.5mm","蜡型边缘与颈缘线平齐但允许有细微飞边"],"answer":[1],"explanation":"知识点：熔模铸造中蜡型颈缘的贴合标准。正确项：蜡型边缘应与颈缘线平齐且光滑无飞边，才能保证铸件边缘密合。A项超出颈缘线会导致铸件边缘过长压迫牙龈。C项缩于颈缘线内会造成铸件边缘短、密合差。D项飞边会使铸件边缘粗糙、就位不良。","tier":"进阶"},{"id":52,"type":"single","stem":"制作钴铬合金铸造支架时，模型上需要填补的倒凹通常位于","options":["基牙颊侧主要倒凹区","基牙舌侧非倒凹区","缺牙区牙槽嵴顶","基牙邻面接触区"],"answer":[0],"explanation":"知识点：活动义齿支架蜡型制作中倒凹填补原则。正确项：基牙颊侧主要倒凹区需要填补，以便卡环臂进入适当倒凹深度。B项舌侧非倒凹区无需填补，该处本就无倒凹。C项牙槽嵴顶属缺牙区，不是卡环倒凹填补部位。D项邻面接触区不涉及倒凹填补。","tier":"基础"},{"id":53,"type":"single","stem":"固定桥熔模制作时，桥体龈端与缺牙区黏膜之间应保持的接触关系是","options":["完全贴合接触无间隙","轻接触并留出可清洁的间隙","留有约2mm的明显间隙","仅桥体两端接触黏膜"],"answer":[1],"explanation":"知识点：固定桥桥体龈端与黏膜的接触关系。正确项：桥体龈端应与黏膜轻接触并留出可清洁间隙，兼顾舒适与自洁。A项完全贴合无间隙会压迫黏膜且难以清洁。C项2mm间隙过大易积存食物且不美观。D项仅两端接触会造成中部悬空、食物嵌塞。","tier":"进阶"},{"id":54,"type":"single","stem":"在可摘局部义齿制作中，弯制卡环时选用不锈钢丝直径的常见规格是","options":["0.5mm","0.7mm","0.9mm","1.2mm"],"answer":[2],"explanation":"知识点：弯制卡环常用不锈钢丝规格。正确项：弯制卡环通常选用0.9mm不锈钢丝，兼顾弹性与强度。A项0.5mm过细，卡环易变形、固位不足。B项0.7mm偏细，多用于个别小连接体。D项1.2mm过粗，弹性差，不易弯制且易损伤基牙。","tier":"基础"},{"id":55,"type":"single","stem":"义齿基托树脂加热聚合时，水浴加热从室温升至沸点应控制的时间约为","options":["10分钟","30分钟","60分钟","120分钟"],"answer":[1],"explanation":"知识点：热凝基托树脂水浴聚合的升温程序。正确项：从室温升至沸点约需30分钟，缓慢升温可减少气泡和变形。A项10分钟升温过快，树脂内部易产生气泡。C项60分钟过慢，影响效率且无必要。D项120分钟更慢，不符合常规工艺。","tier":"基础"},{"id":56,"type":"single","stem":"铸造完成后，钴铬合金铸件表面残留的包埋材料最适宜采用的清理方式是","options":["用钢丝刷直接干刷","喷砂机用氧化铝砂粒喷砂","用锤子敲击震落","浸泡在清水中自然软化"],"answer":[1],"explanation":"知识点：铸件清理中包埋材料的去除方法。正确项：喷砂用氧化铝砂粒可有效去除残留包埋料且不损伤铸件。A项钢丝刷干刷难以去除牢固粘附的包埋料且易划伤。C项敲击震落易使铸件变形或损伤边缘。D项清水浸泡无法软化已烧结的包埋料。","tier":"进阶"},{"id":57,"type":"single","stem":"在全口义齿排牙时，前牙排列应遵循的颌平面位置是","options":["平分上下颌间距离","靠近上颌牙槽嵴顶","靠近下颌牙槽嵴顶","位于上颌牙槽嵴顶下方2mm"],"answer":[0],"explanation":"知识点：全口义齿前牙排列的颌平面定位原则。正确项：颌平面应平分上下颌间距离，保证上下前牙对称协调。B项靠近上颌会造成下前牙过长、咬合异常。C项靠近下颌会使上前牙过长、不美观。D项固定下移2mm缺乏依据，破坏对称关系。","tier":"基础"},{"id":58,"type":"single","stem":"制作石膏代型时，分离剂涂布的主要作用是","options":["增加石膏表面强度","防止蜡型与石膏粘连","加速石膏凝固","使石膏表面更光滑"],"answer":[1],"explanation":"知识点：石膏代型表面分离剂的作用。正确项：分离剂的作用是防止蜡型与石膏粘连，便于蜡型取下。A项分离剂不增加石膏强度。C项分离剂不影响石膏凝固速度。D项使表面光滑不是分离剂的主要功能。","tier":"基础"},{"id":59,"type":"single","stem":"焊接钴铬合金支架时，焊接区预热的主要目的是","options":["去除金属表面氧化层","使焊接区温度均匀防止变形","增加焊料的流动性","提高焊接区的硬度"],"answer":[1],"explanation":"知识点：支架焊接前预热的作用。正确项：预热使焊接区整体温度均匀，防止局部受热不均导致变形。A项去氧化层靠酸洗或打磨，非预热。C项焊料流动性靠焊剂和温度配合，预热不是主因。D项预热不提高硬度，硬度由材料本身决定。","tier":"基础"},{"id":60,"type":"single","stem":"在义齿加工厂，某技师在完成钴铬合金支架铸造后，发现铸件卡环臂内侧有约1mm的金属瘤，正确的处置步骤是","options":["直接戴入患者口内试戴观察","用高速手机磨除金属瘤后抛光","用喷砂处理金属瘤后直接交付","将铸件退回重新铸造"],"answer":[1],"explanation":"知识点：铸件缺陷的修整处置。正确项：金属瘤属局部缺陷，用高速手机磨除并抛光即可修复。A项带瘤试戴会损伤基牙且无法就位。C项喷砂无法去除较大金属瘤。D项1mm金属瘤可修整，不必重铸造成浪费。","tier":"挑战"},{"id":61,"type":"single","stem":"某技师在制作活动义齿时，将模型浸泡在水中过夜后才开始制作蜡型，最可能导致的问题是","options":["模型表面吸水膨胀影响精度","模型表面变得更坚硬","蜡型更容易与模型分离","模型颜色发生变化"],"answer":[0],"explanation":"知识点：石膏模型浸水对精度的影响。正确项：石膏吸水膨胀会使模型尺寸变化，影响蜡型精度。B项浸水不会使石膏变硬。C项分离难易取决于分离剂，与浸水无直接关系。D项颜色变化不影响制作精度，非主要问题。","tier":"进阶"},{"id":62,"type":"multi","stem":"制作可摘局部义齿支架蜡型时，需要完成的组成部分包括","options":["卡环臂和卡环体","支托和邻面板","大连接体和小连接体","基托蜡型与人工牙","对颌模型与咬合记录"],"answer":[0,1,2],"explanation":"知识点：支架蜡型的组成结构。正确项：卡环臂与卡环体、支托与邻面板、大小连接体均属支架蜡型应完成的部件。D项基托蜡型与人工牙属排牙和基托制作阶段，不在支架蜡型范围内。E项对颌模型与咬合记录是颌位记录阶段的产物，不是支架蜡型组成部分。","tier":"挑战"},{"id":63,"type":"single","stem":"在石膏模型上制作全口义齿蜡基托时，蜡片加热后应贴合到模型哪一区域后再修整边缘","options":["覆盖整个模型基托伸展范围并稍超出边缘线","仅覆盖牙槽嵴顶区域再向两侧推开","只贴合唇颊侧边缘区再向舌侧推压","先贴在腭部中央再向四周摊开"],"answer":[0],"explanation":"知识点为蜡基托的贴合范围。正确项：蜡片软化后先覆盖整个基托伸展范围并稍超出边缘线，再沿边缘线修整，可保证基托完整连续。错误项A仅覆盖嵴顶会导致边缘缺失；错误项B只贴一侧无法形成完整基托；错误项C先贴中央再摊开会造成厚度不均和气泡。","tier":"进阶"},{"id":64,"type":"single","stem":"可摘局部义齿支架在模型上就位时，卡环臂末端应位于基牙的哪个位置","options":["倒凹区内靠近龈缘的釉面","倒凹区以上的非倒凹区","牙冠外形高点处","邻面接触点下方的釉面"],"answer":[0],"explanation":"知识点为卡环臂末端位置。正确项：卡环臂末端进入倒凹区才能产生固位力。错误项A在非倒凹区则无固位作用；错误项B外形高点处为导平面区不产生卡抱；错误项C邻面下方为邻面板位置，不是卡环臂末端所在。","tier":"进阶"},{"id":65,"type":"single","stem":"在全口义齿排牙时，上颌前牙唇面应位于切牙乳突中点前方约多少毫米处","options":["8至10毫米","3至5毫米","13至15毫米","18至20毫米"],"answer":[0],"explanation":"知识点为全口义齿前牙排列位置。正确项：上颌前牙唇面通常位于切牙乳突中点前8至10毫米，符合面部丰满度要求。错误项A过小会致唇侧塌陷；错误项B过大致唇侧过突；错误项C过大明显超出正常范围。","tier":"基础"},{"id":66,"type":"single","stem":"活动义齿基托在口内试戴时发现上颌腭部基托边缘过长压迫软腭，正确的处理方式是","options":["标记压痛点后磨除过长边缘并抛光","将整块基托边缘均匀磨短一层","在基托组织面加衬自凝树脂缓冲","用热水浸泡基托使其软化后压贴"],"answer":[0],"explanation":"知识点为基托边缘过长的临床处理。正确项：先标记压痛点，再针对性磨除过长部分并抛光，可保留足够边缘封闭。错误项A均匀磨短会破坏边缘封闭；错误项B加衬不能解决边缘过长；错误项C热水中基托变形会破坏适合性。","tier":"挑战"},{"id":67,"type":"single","stem":"制作钴铬合金铸造卡环时，蜡型卡环臂的厚度应控制在多少毫米以保证既有弹性又有强度","options":["0.6至0.8毫米","1.5至2.0毫米","2.5至3.0毫米","0.2至0.3毫米"],"answer":[0],"explanation":"知识点为卡环臂蜡型厚度。正确项：0.6至0.8毫米是钴铬合金卡环臂常用厚度，兼顾弹性与强度。错误项A过厚则弹性不足；错误项B过厚更硬易损伤基牙；错误项C过薄则强度不足易变形折断。","tier":"基础"},{"id":68,"type":"single","stem":"树脂基托在打磨抛光时，若转速过高且未充分冷却，最可能出现的结果是","options":["基托表面树脂熔化发白并产生焦痕","基托颜色变得更透明均匀","基托边缘自动变薄形成封闭","基托组织面变得更光滑"],"answer":[0],"explanation":"知识点为树脂基托打磨抛光要点。正确项：转速过高未冷却会使树脂局部升温熔化，出现发白、焦痕。错误项A颜色不会变均匀反而发白；错误项B边缘不会自动变薄；错误项C组织面不会因此变光滑。","tier":"进阶"},{"id":69,"type":"single","stem":"铸造支架在电解抛光后表面仍存在局部粗糙，最可能的原因是","options":["电解抛光前喷砂或打磨不彻底留下氧化层","电解液温度偏低但时间足够","电解抛光后立即用清水冲洗","支架在铸造后未进行热处理"],"answer":[0],"explanation":"知识点为电解抛光前处理。正确项：喷砂或打磨不彻底会残留氧化层和粗糙面，电解抛光难以消除。错误项A温度偏低但时间足够通常仍可抛光；错误项B抛光后冲洗是正常步骤；错误项C热处理与电解抛光粗糙无直接关系。","tier":"基础"},{"id":70,"type":"single","stem":"在制作全口义齿个别托盘时，托盘边缘应比功能印模边缘短多少毫米以便放置印模材料","options":["2至3毫米","8至10毫米","12至15毫米","与功能边缘齐平"],"answer":[0],"explanation":"知识点为个别托盘边缘设计。正确项：个别托盘边缘应比功能印模边缘短2至3毫米，为印模材料留出空间。错误项A过短会导致边缘不足；错误项B过短更多；错误项C齐平则无材料空间。","tier":"基础"},{"id":71,"type":"multi","stem":"关于可摘局部义齿支架蜡型在模型上完成后的检查，下列哪些做法是必要的","options":["检查卡环臂是否进入倒凹区并贴合基牙","检查支托是否与支托窝密合且不压迫牙龈","检查连接体是否与模型紧密贴合无翘动","检查蜡型是否避开所有倒凹以免就位困难","检查卡环臂末端是否位于非倒凹区以利取戴"],"answer":[0,1,2],"explanation":"知识点为支架蜡型检查要点。正确项：卡环臂需进入倒凹、支托需密合不压龈、连接体需贴合无翘动，均为必要检查。错误项A避开所有倒凹会使支架无固位；错误项B卡环臂末端在非倒凹区则不起固位作用。","tier":"挑战"},{"id":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聚合速度快、放热集中，峰值温度较高，且收缩较大；热凝树脂缓慢升温聚合，放热平缓、收缩较小。其余选项对放热与收缩的搭配均不正确。","tier":"基础"},{"id":109,"type":"single","stem":"某技师在制作可摘局部义齿时，将模型上的舌杆位置设计在舌侧倒凹区，该设计最可能导致","options":["义齿就位困难且压迫舌侧黏膜","舌杆强度不足易变形","义齿固位力明显增强","基托边缘封闭效果改善"],"answer":[0],"explanation":"知识点为舌杆位置设计与倒凹的关系。舌杆应位于舌侧非倒凹区或轻接触区，若置于倒凹区会阻碍就位并压迫黏膜；舌杆强度取决于截面形态而非位置；置于倒凹区不会增强固位反而阻碍就位；基托边缘封闭与舌杆位置无关。","tier":"进阶"},{"id":110,"type":"multi","stem":"在可摘局部义齿制作中，以下哪些做法有助于提高义齿的固位效果","options":["合理设计卡环进入倒凹的深度","基托边缘延伸至黏膜转折处","人工牙排列尽量偏向颊侧","适当增加间接固位体","基托组织面进行缓冲处理"],"answer":[0,1,3],"explanation":"知识点为可摘局部义齿固位设计。卡环进入倒凹适当深度可提供固位力；基托边缘延伸至黏膜转折处有利于边缘封闭；间接固位体可防止义齿翘动。人工牙偏向颊侧会破坏咬合平衡，不利于固位；基托组织面缓冲是防止压痛的措施，与固位无直接关系。","tier":"挑战"},{"id":111,"type":"single","stem":"在石膏模型上制作熔模时，蜡型边缘与预备体颈缘的贴合要求是","options":["蜡型边缘略短于颈缘，留出0.5mm间隙以便包埋","蜡型边缘与颈缘密合无缝隙且无飞边","蜡型边缘超出颈缘0.3mm以保证边缘完整","蜡型边缘与颈缘贴合但允许有小于0.2mm的台阶"],"answer":[1],"explanation":"知识点为熔模边缘精度要求。蜡型边缘必须与颈缘密合、无缝隙无飞边，才能保证铸件边缘密合。蜡型边缘短于颈缘会造成铸件边缘不足；超出颈缘会形成飞边导致就位不良；允许台阶同样会造成边缘不密合。","tier":"进阶"},{"id":112,"type":"single","stem":"制作可摘局部义齿时，模型观测中用于确定义齿就位道的工具是","options":["平行研磨仪","石膏修整机","真空搅拌机","琼脂复制机"],"answer":[0],"explanation":"知识点为观测与就位道确定。平行研磨仪用于观测模型倒凹、确定就位道并研磨模型。石膏修整机用于修整模型外形；真空搅拌机用于石膏或包埋材料搅拌；琼脂复制机用于复制耐火模型，均与就位道确定无关。","tier":"基础"},{"id":113,"type":"single","stem":"固定桥熔模铸造后，铸件在模型上试戴时发现邻接过紧无法就位，最可能的原因是","options":["熔模邻面蜡型加蜡过多","包埋材料膨胀量不足","铸造温度偏低","铸件表面喷砂过度"],"answer":[0],"explanation":"知识点为邻接过紧的原因分析。邻接过紧多因熔模邻面加蜡过多使铸件邻面尺寸偏大。包埋膨胀不足会使铸件整体偏小而非邻接过紧；铸造温度偏低易造成铸造不全；喷砂过度会磨除部分表面使邻接变松。","tier":"挑战"},{"id":114,"type":"single","stem":"在全口义齿排牙时，上前牙唇面与合平面关系通常要求切缘略微","options":["向唇侧倾斜并高于合平面","向舌侧倾斜并低于合平面","与合平面平行且位于其上方","向唇侧倾斜并低于合平面"],"answer":[0],"explanation":"知识点为全口义齿前牙排列。上前牙切缘应略向唇侧倾斜并高于合平面，以形成正常覆合覆盖和美观。向舌侧倾斜或低于合平面会形成反合或覆合异常；与合平面平行不符合前牙自然排列。","tier":"基础"},{"id":115,"type":"single","stem":"制作钴铬合金支架熔模时，连接体与基牙卡环之间的蜡连接应","options":["留有0.5mm间隙以利收缩补偿","紧密连接无空隙且过渡平滑","用薄蜡片隔离便于后期分割","仅点状连接以方便调整"],"answer":[1],"explanation":"知识点为支架熔模连接要求。连接体与卡环之间应紧密连接、过渡平滑，保证铸造后整体强度。留间隙会造成铸造缺陷；薄蜡片隔离会使支架分离；点状连接强度不足易断裂。","tier":"基础"},{"id":116,"type":"single","stem":"义齿基托树脂热处理时，水浴加热的升温速度过快最容易导致","options":["基托颜色变浅","基托内产生气泡","基托与模型分离","基托表面变粗糙"],"answer":[1],"explanation":"知识点为树脂热处理工艺。升温过快使树脂内部单体汽化来不及排出，形成气泡。颜色变浅多与单体比例或引发剂有关；基托与模型分离多因分离剂问题；表面粗糙多与模型或抛光有关。","tier":"基础"},{"id":117,"type":"single","stem":"某技师在制作烤瓷熔附金属冠时，金属基底冠完成后再堆瓷，发现瓷层与金属结合不良，下列最可能的原因是","options":["金属基底冠表面未做喷砂粗化处理","瓷粉堆塑时振动不够","瓷层烧结温度低于瓷粉要求","瓷层厚度超过2mm"],"answer":[0],"explanation":"知识点为金瓷结合机制。金瓷结合依赖金属表面的粗化和氧化层，未喷砂粗化会显著降低结合力。振动不够影响瓷层致密度而非结合；烧结温度低影响瓷层熔融；瓷层过厚影响强度但非结合不良主因。","tier":"挑战"},{"id":118,"type":"single","stem":"铸造完成后，钴铬合金铸件表面出现较多粘砂，最可能的操作原因是","options":["包埋材料粉液比中液体过多","包埋时未抽真空或振荡不足","铸造时熔金温度过低","铸件冷却速度过快"],"answer":[1],"explanation":"知识点为包埋工艺与粘砂关系。包埋时未抽真空或振荡不足会使包埋材料中气泡附着铸型表面，导致粘砂。粉液比液体过多会降低包埋强度；熔金温度过低易铸造不全；冷却过快易变形，均非粘砂主因。","tier":"进阶"},{"id":119,"type":"single","stem":"某加工厂收到一副全口义齿模型，技师在制作个别托盘前发现模型边缘系带区缓冲不足，正确处置是","options":["直接在模型上刮除系带区石膏再制作个别托盘","先填补模型缺损再制作个别托盘","在模型系带区用蜡做缓冲后再制作个别托盘","忽略该问题直接制作个别托盘"],"answer":[2],"explanation":"知识点为个别托盘制作前的模型处理。系带区缓冲不足会影响印模边缘，应用蜡缓冲后再制作个别托盘。直接刮除石膏会破坏模型；填补缺损与缓冲无关；忽略会导致印模边缘过长或系带压迫。","tier":"挑战"},{"id":120,"type":"single","stem":"在焊接义齿支架断裂处时，为防止焊接变形，通常采取的措施是","options":["加大焊料用量快速焊接","将支架整体加热至焊接温度再焊接","用石膏或包埋材料固定支架后再焊接","在断裂处两端同时加热焊接"],"answer":[2],"explanation":"知识点为焊接防变形措施。用石膏或包埋材料固定支架可限制焊接热变形。加大焊料用量会加剧变形；整体加热不现实且变形大；两端同时加热难以控制且易过热。","tier":"基础"},{"id":121,"type":"multi","stem":"在制作全口义齿基托时，下列哪些操作有助于减少基托内气泡的产生","options":["按粉液比准确称量并充分调和","调拌后静置片刻使气泡上浮","采用水浴缓慢升温加热","调和后立即加压填塞","填塞时少量多次添加树脂"],"answer":[0,1,2],"explanation":"知识点为基托树脂气泡控制。准确粉液比与充分调和不引入过多气泡；静置使气泡上浮排出；缓慢升温使单体汽化少。立即加压填塞会裹入气泡；少量多次添加易分层裹气，均不利于减少气泡。","tier":"挑战"},{"id":122,"type":"single","stem":"制作钴铬合金铸造支架时，模型上需要预先留出铸造收缩补偿量，这一补偿通常加在","options":["工作模型整体放大","耐火模型材料凝固膨胀","蜡型表面涂布间隙漆","铸道口处加储金球"],"answer":[1],"explanation":"知识点是铸造收缩补偿原理。钴铬合金冷却收缩靠耐火模型材料的凝固膨胀来补偿，故正确项对；工作模型整体放大是树脂牙或个别托盘的做法，与支架铸造补偿无关；蜡型涂间隙漆是控制铸件与基牙间隙，不补偿收缩；储金球用于补缩，不解决整体收缩。","tier":"进阶"},{"id":123,"type":"single","stem":"可摘局部义齿支架弯制时，卡环臂进入基牙倒凹区的深度一般控制在","options":["0.25mm左右","0.75mm左右","1.25mm左右","1.75mm左右"],"answer":[0],"explanation":"知识点是卡环固位臂倒凹深度。铸造/弯制钴铬卡环通常取0.25mm左右，既保证固位又便于就位，故正确；0.75mm以上倒凹过深，就位困难且易损伤基牙；1.25mm与1.75mm更超出常规，属相邻参数混淆。","tier":"进阶"},{"id":124,"type":"single","stem":"制作全口义齿时，确定后堤区的位置主要依据","options":["腭中缝的走向","腭小凹与颤动线","上颌结节的高度","翼上颌切迹的宽度"],"answer":[1],"explanation":"知识点是全口义齿后堤区定位。后堤区位于腭小凹后约2mm至颤动线之间，故正确；腭中缝走向与后堤无关；上颌结节高度影响边缘伸展但不定位后堤；翼上颌切迹是后缘边界标志之一，不是后堤区主要依据。","tier":"基础"},{"id":125,"type":"single","stem":"装盒时，将模型与蜡型包埋于下层型盒石膏中，蜡型暴露面应","options":["完全埋入石膏内","与石膏表面平齐","略高于石膏表面","低于石膏表面约2mm"],"answer":[1],"explanation":"知识点是装盒分层要求。下层石膏应包埋模型并使蜡型暴露面与石膏面平齐，便于上层石膏灌注形成阴模，故正确；完全埋入则无法形成型腔；略高或过低都会造成型腔变形或气泡。","tier":"基础"},{"id":126,"type":"single","stem":"热凝基托树脂填塞后，进行水浴加热固化时，从室温升至沸点的时间应控制在","options":["10分钟内快速升温","30分钟内缓慢升温","60分钟内均匀升温","120分钟内逐步升温"],"answer":[2],"explanation":"知识点是热凝树脂固化升温程序。通常控制在60分钟左右均匀升温至沸点，以减少气泡和变形，故正确；10分钟或30分钟升温过快，易产生气泡；120分钟过长，影响效率且无必要。","tier":"进阶"},{"id":127,"type":"single","stem":"在义齿加工中，模型消毒常采用的方法是","options":["紫外线照射模型表面","2%戊二醛浸泡模型","干热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强度抵抗咀嚼变形。0.3～0.4mm过薄，铸造后卡环易折断或永久变形；1.0～1.2mm过厚，卡环刚性过大难以就位且易损伤基牙；1.5～1.8mm远超常规，卡环无法正常发挥弹性卡抱作用。","tier":"基础"},{"id":163,"type":"single","stem":"在石膏模型上填倒凹制作可摘局部义齿时，基牙颊侧近中倒凹区需要保留的深度通常依据什么确定","options":["卡环材料的弹性极限","观测线到龈缘的距离","模型石膏的膨胀率","义齿基托的厚度"],"answer":[0],"explanation":"知识点为填倒凹量与卡环材料弹性极限的关系。填倒凹的目的是使卡环能顺利就位且对基牙产生适当卡抱力，保留的倒凹深度须在卡环材料弹性许可范围内。观测线到龈缘距离影响卡环臂长度设计而非倒凹保留量；石膏膨胀率影响模型尺寸精度；基托厚度与填倒凹深度无直接关系。","tier":"进阶"},{"id":164,"type":"single","stem":"某技师在制作全口义齿蜡型时发现下颌磨牙后垫区蜡型过厚，最可能影响义齿的哪项性能","options":["义齿的固位与稳定","人工牙的咬合高度","基托的色泽均匀性","蜡型的表面光洁度"],"answer":[0],"explanation":"知识点为磨牙后垫区蜡型厚度对全口义齿功能的影响。磨牙后垫区蜡型过厚会抬高基托边缘，破坏后堤封闭，导致义齿固位不良和稳定性下降。咬合高度由人工牙排列和颌位关系决定，与蜡型厚度无关；色泽均匀性由基托材料决定；表面光洁度取决于打磨抛光而非蜡型厚度。","tier":"挑战"},{"id":165,"type":"single","stem":"铸造支架式可摘局部义齿的大连接体在放置于石膏模型上时，与模型之间应保持多大间隙以便日后缓冲","options":["0mm，完全贴合","0.1～0.2mm","0.5～1.0mm","1.5～2.0mm"],"answer":[2],"explanation":"知识点为大连接体与模型的缓冲间隙。大连接体（如腭板、舌板）与组织面之间需留有0.5～1.0mm间隙，为印模和模型误差、组织变形及日后衬垫预留空间。完全贴合会导致义齿压迫黏膜无法就位；0.1～0.2mm间隙过小，无法补偿加工误差；1.5～2.0mm间隙过大，会造成食物嵌塞且影响义齿强度。","tier":"基础"},{"id":166,"type":"single","stem":"焊接可摘局部义齿支架时，为防止焊接区变形，通常采取的措施是","options":["先固定焊接区再整体加热","将支架整体包埋在耐热材料中","用大火快速集中加热焊接点","在焊接区涂抹石膏作为保护层"],"answer":[1],"explanation":"知识点为支架焊接的防变形措施。将支架整体包埋在耐热材料（如耐火石膏）中，仅暴露焊接区，可限制热膨胀和冷却收缩造成的变形。先固定焊接区再整体加热会使热量扩散导致其他部位变形；大火快速集中加热会增大局部热应力；焊接区涂石膏会妨碍焊接操作而非防止变形。","tier":"基础"},{"id":167,"type":"single","stem":"某技师在制作上颌全口义齿时，发现模型后堤区未做适当刮除，这最可能导致","options":["义齿基托边缘过长","义齿后缘封闭不良","人工牙排列偏唇侧","义齿中线偏移"],"answer":[1],"explanation":"知识点为后堤区处理与义齿封闭的关系。上颌全口义齿后堤区需在模型上适当刮除，使基托后缘能压入黏膜可动区形成后堤封闭。未刮除则基托后缘无法有效压入，封闭不良导致固位差。基托边缘长度由边缘整塑决定；人工牙排列位置与后堤区处理无关；中线偏移由排牙定位决定。","tier":"挑战"},{"id":168,"type":"single","stem":"在制作可摘局部义齿时，选择成品钢丝卡环与铸造卡环的主要区别在于","options":["卡环臂的横截面形状不同","卡环臂的长度不同","卡环臂的弹性不同","卡环臂的颜色不同"],"answer":[2],"explanation":"知识点为成品钢丝卡环与铸造卡环的性能差异。成品钢丝卡环为冷加工金属，弹性优于铸造卡环，适用于需要较大弹性进入倒凹的情况；铸造卡环刚性好但弹性较差。两者横截面形状可相似，长度可按需设计，颜色均属金属色，这些不是区分两者的主要性能指标。","tier":"进阶"},{"id":169,"type":"single","stem":"某义齿加工企业接到一例钴铬合金铸造支架订单，技师在铸造后发现支架表面有较多气孔，下列哪项是最可能的工艺原因","options":["铸造温度过高导致合金氧化","铸圈焙烧温度不足或时间不够","合金熔炼时未加入足够的新金属","铸造后冷却速度过快"],"answer":[1],"explanation":"知识点为铸造气孔缺陷的成因。铸圈焙烧温度不足或时间不够，会使蜡型残留物未完全挥发，铸造时产生气体形成气孔。铸造温度过高主要导致合金氧化和晶粒粗大；未加足够新金属会影响合金成分和流动性，但气孔主因是排气不良；冷却速度过快主要引起收缩变形而非气孔。","tier":"挑战"},{"id":170,"type":"single","stem":"制作可摘局部义齿时，模型观测的主要目的是确定","options":["基牙的牙冠高度","义齿的就位道和倒凹区","基托的伸展范围","人工牙的排列位置"],"answer":[1],"explanation":"知识点为模型观测的核心目的。模型观测通过观测线分析确定义齿的就位道、倒凹区和非倒凹区，为卡环设计和基托边缘定位提供依据。牙冠高度可通过直接测量获得；基托伸展范围由功能整塑和解剖标志决定；人工牙排列与观测无直接关系。","tier":"基础"},{"id":171,"type":"multi","stem":"制作全口义齿蜡型时，下列哪些操作有助于获得良好的基托边缘封闭","options":["在模型后堤区适当刮除后加压蜡型","蜡型边缘在系带处做缓冲让开","蜡型边缘在黏膜转折处做适当伸展","蜡型表面用火焰吹光后立即冷却","蜡型边缘在硬区做加压处理"],"answer":[0,1,2],"explanation":"知识点为全口义齿基托边缘封闭的蜡型操作要点。后堤区刮除后加压蜡型可形成后堤封闭；系带处缓冲让开可避免边缘压迫系带影响封闭；黏膜转折处适当伸展可保证边缘与功能整塑一致。蜡型表面火焰吹光后立即冷却会影响蜡型内部应力而非边缘封闭；硬区加压会导致基托压迫黏膜产生疼痛而非改善封闭。","tier":"挑战"},{"id":172,"type":"single","stem":"在石膏模型上制作熔模时，蜡型邻面接触区的厚度通常应控制在","options":["0.1mm左右","0.3mm左右","0.8mm左右","1.5mm左右"],"answer":[0],"explanation":"知识点为熔模蜡型邻面接触区厚度。正确项0.1mm左右符合邻面接触区应薄而密合的要求，便于铸造后形成合适接触。0.3mm偏厚会造成邻接过紧；0.8mm过厚会明显顶开邻牙；1.5mm严重过厚，临床无法就位。","tier":"基础"},{"id":173,"type":"single","stem":"可摘局部义齿支架蜡型在模型上完成后，进行包埋前最需要检查的部位是","options":["卡环臂与模型牙面的密合程度","舌杆表面是否抛光","基托边缘是否已打磨","人工牙是否已排好"],"answer":[0],"explanation":"知识点为支架蜡型包埋前检查。卡环臂与基牙牙面密合程度直接决定义齿固位和就位，必须包埋前确认。舌杆抛光在铸造后完成；基托边缘打磨也在铸造后；人工牙排牙多在支架完成并上架后进行。","tier":"进阶"},{"id":174,"type":"single","stem":"用自凝树脂修补基托折裂处时，为减小修补后色差和气泡，较合适的操作是","options":["将断面清洁后直接堆自凝树脂加压固化","将断面磨成斜面并涂单体溶胀后再填补","将断面用蜡封闭后灌注树脂","将断面加热至发白后立即加树脂"],"answer":[1],"explanation":"知识点为自凝树脂修补基托工艺。斜面加单体溶胀可使新旧树脂结合良好并减少气泡色差。直接堆树脂结合差易气泡；蜡封闭会阻碍结合；加热发白会使树脂变形且不利结合。","tier":"进阶"},{"id":175,"type":"single","stem":"在全口义齿排牙时，前牙排列应主要参考","options":["患者旧义齿的磨耗程度","患者面部中线及唇线等面部标志","患者对侧后牙的咬合关系","义齿基托的厚度分布"],"answer":[1],"explanation":"知识点为全口义齿前牙排列参考标志。前牙位置需与面部中线、唇线、口角线协调。旧义齿磨耗反映使用情况而非排列依据；对侧后牙咬合在排牙中参考但不是前牙主要依据；基托厚度与排牙位置无直接对应。","tier":"基础"},{"id":176,"type":"single","stem":"制作金属烤瓷冠时，金属基底冠的瓷覆盖区蜡型厚度不足会导致","options":["瓷层过厚易崩瓷","金属透色影响美观","基底冠边缘密合度提高","金瓷结合强度增加"],"answer":[0],"explanation":"知识点为金属烤瓷冠基底冠厚度与瓷层关系。基底冠过薄会使瓷层相对过厚，收缩应力大易崩瓷。金属透色与瓷层厚度关系相反；边缘密合度由边缘蜡型决定；金瓷结合强度不由瓷层过厚增加。","tier":"基础"},{"id":177,"type":"single","stem":"在模型上弯制不锈钢丝卡环时，为避免卡环臂折断，弯制顺序通常是","options":["先弯卡环臂再弯连接体","先弯连接体再弯卡环臂","先弯卡环尖再弯卡环肩","先弯卡环肩再弯卡环尖"],"answer":[1],"explanation":"知识点为不锈钢丝卡环弯制顺序。先弯连接体便于夹持和后续调整，再弯卡环臂可减少反复弯折折断。先弯卡环臂或卡环尖会使连接体难以成形；先弯卡环肩再弯卡环尖易在臂部反复受力。","tier":"进阶"},{"id":178,"type":"single","stem":"可摘局部义齿基托蜡型在模型上完成后，装盒前需要修整基托边缘，其主要目的是","options":["使基托边缘与模型边缘一致并形成圆钝外形","使基托边缘尽量锐利以利于就位","使基托边缘离开模型少许便于开盒","使基托边缘加厚以增加强度"],"answer":[0],"explanation":"知识点为基托蜡型边缘修整。基托边缘应与模型边缘一致并圆钝，患者佩戴舒适。锐利边缘会刺激黏膜；离开模型会导致边缘不密合；单纯加厚不解决边缘形态问题。","tier":"进阶"},{"id":179,"type":"single","stem":"某技师在制作钴铬合金支架时，发现铸件表面出现较多圆形气孔，最可能的原因是","options":["包埋料搅拌时混入过多气体","铸造时合金温度过低","铸圈预热时间过长","蜡型表面涂布过多分离剂"],"answer":[0],"explanation":"知识点为铸造气孔缺陷原因。包埋料搅拌混入气体易在铸件表面形成圆形气孔。合金温度过低多导致浇不足；预热过长主要影响铸型强度；分离剂过多影响蜡型表面但一般不形成圆形气孔。","tier":"挑战"},{"id":180,"type":"single","stem":"患者戴用新制作的可摘局部义齿后主诉右侧基托边缘压痛，检查见该处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理并恢复后牙接触；错误项降低后牙并加高前牙会加重前牙过紧；错误项整体降低不能解决前后不均衡；错误项不调整直接装盒会复制错误咬合关系。","tier":"挑战"},{"id":198,"type":"single","stem":"可摘局部义齿的卡环臂在模型上弯制时，若卡环臂尖端进入倒凹区过深，戴入口内后最可能出现的问题是","options":["义齿就位困难且摘戴时基牙疼痛","义齿基托边缘过长压迫黏膜","义齿咬合面出现早接触","义齿连接体与基牙间出现缝隙"],"answer":[0],"explanation":"知识点为卡环倒凹深度与就位关系。正确项是卡环尖端进入倒凹过深会阻碍就位并产生对基牙的侧向力引起疼痛；错误项基托边缘过长与卡环倒凹无关；错误项咬合早接触由咬合关系决定；错误项连接体缝隙与卡环臂倒凹深度无直接关系。","tier":"进阶"},{"id":199,"type":"single","stem":"在制作全口义齿时，模型上颌后堤区的处理正确的是","options":["后堤区刮除适量石膏形成轻微凹陷","后堤区堆加石膏形成明显隆起","后堤区保持原模型形态不做处理","后堤区用蜡填平后再装盒"],"answer":[0],"explanation":"知识点为全口义齿后堤区处理。正确项是后堤区适当刮除石膏形成轻微凹陷，使基托边缘在此处略厚以形成良好封闭；错误项堆加石膏会使基托过厚压迫软腭；错误项不处理可能封闭不足；错误项用蜡填平会失去后堤封闭作用。","tier":"进阶"},{"id":200,"type":"multi","stem":"在制作铸造支架蜡型时，下列哪些做法有助于减少铸造后支架的收缩变形","options":["蜡型各部位厚度尽量均匀过渡","在蜡型较厚处设置储金球","将蜡型直接放入高温炉快速升温","在模型上分段制作蜡型后焊接"],"answer":[0,1],"explanation":"知识点为铸造收缩变形控制。正确项厚度均匀过渡可减少冷却收缩不均；正确项设置储金球可补充凝固收缩；错误项快速升温会使蜡型变形且与收缩控制无关；错误项分段焊接会引入焊接变形，不利于减少整体收缩。","tier":"挑战"},{"id":201,"type":"single","stem":"制作钴铬合金铸造支架时，模型上的单侧游离缺失区需要设置应力中断，下列做法中能实现应力中断的是","options":["将游离端鞍式大连接体与基牙侧大连接体之间留出 0.3mm 间隙，用自凝树脂暂时固定后铸造","将游离端鞍式大连接体的蜡型与基牙侧蜡型直接连成整体一次铸造","在基牙侧大连接体上钻一个直径 1mm 的圆孔以分散咬合力","将游离端鞍式大连接体厚度减薄至基牙侧大连接体的二分之一"],"answer":[0],"explanation":"知识点为应力中断式支架的工艺实现。正确项：游离端与基牙侧之间预留间隙并用树脂暂连，铸造后去除树脂即形成可动连接，实现应力中断。错误项：整体连铸使两侧成为刚性整体，无法中断应力；钻孔只改变局部形态，不产生可动连接；单纯减薄厚度只是降低刚性，仍为整体连接，不能替代应力中断结构。","tier":"挑战"},{"id":202,"type":"single","stem":"在可摘局部义齿支架的模型观测中，基牙倒凹深度为 0.5mm 时，若采用钴铬合金铸造卡环，其卡环臂末端通常应进入倒凹的深度是","options":["0.25mm","0.50mm","0.75mm","1.00mm"],"answer":[0],"explanation":"知识点为铸造卡环在基牙倒凹中的就位深度。钴铬合金弹性较差，卡环臂末端进入倒凹深度一般控制在 0.25mm 左右，以获得足够固位力又不致永久变形。错误项：0.50mm 是弯制不锈钢丝卡环常参考的深度；0.75mm 和 1.00mm 对钴铬铸造卡环过大，就位时易使卡环臂塑性变形或损伤基牙。","tier":"基础"},{"id":203,"type":"single","stem":"用蜡型制作全口义齿基托时，在石膏模型上涂分离剂后，若分离剂未完全干燥就开始铺蜡，最可能出现的后果是","options":["蜡与模型之间夹有水分，压蜡后基托组织面出现气泡或凹凸不平","蜡与模型粘接过牢，脱模时石膏模型表面被蜡带起","分离剂被蜡吸收，基托边缘变脆容易折断","蜡的软化温度降低，铺蜡时流动性变差"],"answer":[0],"explanation":"知识点为基托蜡型制作中分离剂的使用。分离剂未干时铺蜡，水膜受热汽化并被包在蜡与模型之间，冷却后组织面形成气泡或不平整。错误项：分离剂未干不会增强粘接，脱模带起石膏通常与未涂分离剂有关；分离剂是隔离层，不会被蜡大量吸收致边缘变脆；蜡的软化温度由蜡本身决定，与分离剂干湿无关。","tier":"挑战"},{"id":204,"type":"single","stem":"铸造完成后，钴铬合金支架铸件表面出现与蜡型表面完全对应的细小凹坑，最可能的原因是","options":["包埋材料调和时混入过多气泡，气泡附在蜡型表面形成凹坑","铸造时合金液温度过高，冲蚀了包埋材料内壁","铸件在冷却过程中收缩不均，表面被拉出凹陷","打磨时使用的磨头粒度过粗，划出凹坑"],"answer":[0],"explanation":"知识点为铸件表面缺陷的来源判断。包埋时气泡附着在蜡型表面，占据空间，铸件就复制出对应的凹坑。错误项：合金液温度过高表现为局部冲砂或粘砂，不是与蜡型一一对应的凹坑；冷却收缩不均多引起变形或缩孔，位置在内部或厚壁处；磨头划伤是后处理阶段的人为划痕，形态和分布与蜡型表面不对应。","tier":"挑战"},{"id":205,"type":"single","stem":"在制作烤瓷熔附金属冠的金属基底冠时，基底冠表面需要预留金瓷结合的空间，其唇侧瓷层厚度一般应达到","options":["0.3mm 左右","0.5mm 左右","1.0mm 左右","2.0mm 左右"],"answer":[2],"explanation":"知识点为金瓷冠瓷层厚度的工艺要求。唇侧瓷层通常需 1.0mm 左右，才能保证颜色层次和强度。错误项：0.3mm 和 0.5mm 过薄，遮色差且强度不足，易崩瓷；2.0mm 过厚，需过量磨除牙体且可能影响瓷层烧结质量。","tier":"进阶"},{"id":206,"type":"single","stem":"在活动义齿支架的模型处理中，需要填除基牙倒凹以便卡环臂顺利就位，填倒凹用的材料应选用","options":["调拌较稠的超硬石膏","调拌较稀的人造石","蜡片加热后压入倒凹","硅橡胶印模材"],"answer":[0],"explanation":"知识点为模型填倒凹材料的选择。超硬石膏调稠后强度高、不易被蜡型或树脂侵蚀，适合填倒凹。错误项：人造石调稀强度低且易被水浸软；蜡片加热压入后遇热蜡型会熔化，无法稳定存在；硅橡胶有弹性，不能形成坚硬固定的填凹面。","tier":"进阶"},{"id":207,"type":"single","stem":"某技师在制作钴铬合金支架时，铸圈焙烧后立即将铸圈从炉中取出放在室温下冷却至室温再铸造，该操作最可能导致","options":["铸圈温度过低，合金液注入后迅速冷却，铸件出现浇不足","铸圈温度过高，合金液与包埋材料发生剧烈反应","铸圈内包埋材料因急冷产生裂纹，铸件表面粗糙","铸圈内蜡型残留碳未充分挥发，铸件含碳量升高"],"answer":[0],"explanation":"知识点为铸造时铸圈温度对充填的影响。钴铬合金铸造需要铸圈保持较高温度，冷却至室温后合金液迅速失热，流动性下降，造成浇不足。错误项：冷却至室温不存在温度过高问题；包埋材料急冷开裂更多与升温速度过快有关；蜡型残留碳应在焙烧阶段已烧尽，与铸造前冷却无直接关系。","tier":"挑战"},{"id":208,"type":"single","stem":"在弯制不锈钢丝卡环时，为避免卡环臂在基牙上产生扭矩，卡环臂从基牙倒凹区到共同就位道的过渡应","options":["逐渐移行，卡环臂最凸点位于观测线处","突然转折，卡环臂最凸点位于龈方倒凹内","保持直线，卡环臂最凸点位于牙冠外形高点","均匀增粗，卡环臂最凸点位于龈缘处"],"answer":[0],"explanation":"知识点为卡环臂的形态与就位道关系。卡环臂应从倒凹区向共同就位道逐渐移行，最凸点位于观测线处，就位时才能弹性通过而不产生扭矩。错误项：突然转折会在就位时形成杠杆和扭矩；保持直线无法进入倒凹，失去固位；均匀增粗会降低弹性且与最凸点位置无关。","tier":"挑战"},{"id":209,"type":"single","stem":"某加工厂收到一副工作模型，其上缺失牙区石膏表面有明显气泡孔洞，最恰当的处理方式是","options":["用同种石膏调拌后填补孔洞，待凝固后重新修整该区域","直接在该区域铺蜡，气泡被蜡覆盖后不影响密合","用蜡填平孔洞后继续制作，脱模时蜡可随基托带出","用磨头将气泡孔扩大后填入自凝树脂"],"answer":[0],"explanation":"知识点为工作模型缺陷的修补要求。模型表面的气泡孔会影响基托密合，应用同种石膏填补并重新修整，保证组织面形态准确。错误项：直接铺蜡会把气泡形态复制到基托组织面，造成压痛点；用蜡填平在脱模后会形成缺损；用自凝树脂填入与石膏模型材质不同，修整和密合都难以保证。","tier":"挑战"},{"id":210,"type":"single","stem":"在制作可摘局部义齿时，下颌舌杆上缘与舌侧牙龈黏膜之间应保持的间隙一般为","options":["0.1mm 左右","0.5mm 左右","1.5mm 左右","3.0mm 左右"],"answer":[1],"explanation":"知识点为舌杆与黏膜的间隙要求。舌杆上缘与舌侧牙龈之间通常留 0.5mm 左右间隙，避免压迫牙龈又利于清洁。错误项：0.1mm 几乎贴合，易压迫牙龈；1.5mm 和 3.0mm 间隙过大，舌杆位置过低，会挤压舌体并影响舒适度。","tier":"进阶"},{"id":211,"type":"single","stem":"在石膏模型上制作树脂全口义齿基托时，涂分离剂后等待的时间主要取决于","options":["分离剂的挥发程度","石膏模型的吸水速度","树脂材料的聚合放热","基托蜡型的厚度"],"answer":[0],"explanation":"知识点是分离剂的使用时机。分离剂涂布后需待其溶剂挥发成膜才能有效隔离，否则残留溶剂会影响树脂与石膏的界面。石膏吸水速度与分离剂成膜无关；聚合放热是树脂固化阶段的现象；蜡型厚度影响的是基托外形而非分离剂等待时间。","tier":"进阶"},{"id":212,"type":"single","stem":"可摘局部义齿支架焊接时，为防止焊接区氧化影响焊料流动，操作中应","options":["用还原焰并配合焊媒覆盖","用氧化焰快速加热焊区","先自然冷却再补加焊料","把焊件浸入水中再加热"],"answer":[0],"explanation":"知识点是义齿支架焊接的防氧化措施。还原焰可减少氧化，焊媒能覆盖焊区隔绝空气并溶解氧化物，保证焊料润湿流动。氧化焰会加剧金属氧化；先冷却再补焊无法解决已生成的氧化膜；浸水后加热会因水分汽化影响焊接质量。","tier":"挑战"},{"id":213,"type":"single","stem":"铸造义齿钴铬合金支架时，铸模从铸造机取出后应采取的冷却方式是","options":["在室温下自然冷却","立即投入冷水中急冷","用压缩空气快速吹冷","埋入湿砂中缓慢降温"],"answer":[0],"explanation":"知识点是铸模冷却方式对合金性能的影响。钴铬合金铸模通常需在室温下自然冷却，避免急冷造成铸件变形或产生裂纹。立即水冷和吹风急冷都会加大内应力；埋入湿砂降温虽慢但湿度不可控，不是标准做法。","tier":"进阶"},{"id":214,"type":"single","stem":"在模型上弯制不锈钢丝卡环时，为保证卡环臂与基牙贴合且弹性合适，弯制顺序应","options":["先弯卡环臂再弯卡环体","先弯卡环体再弯卡环臂","先弯连接体再弯卡环臂","先弯支托再弯卡环臂"],"answer":[1],"explanation":"知识点是卡环弯制的操作顺序。先弯卡环体便于控制整体位置和角度，再弯卡环臂可保证臂部贴合基牙并具备合适弹性。先弯臂会导致体部难以就位；连接体和支托的弯制顺序不先于卡环体。","tier":"进阶"},{"id":215,"type":"single","stem":"制作可摘局部义齿时，模型观测线倒凹深度的确定直接影响","options":["卡环臂进入倒凹的深度","基托边缘的伸展范围","人工牙的排列位置","咬合平面的高度"],"answer":[0],"explanation":"知识点是观测线与卡环设计的关系。观测线用于确定基牙倒凹，卡环臂需进入适当倒凹深度以获得固位力。基托边缘伸展、人工牙排列和咬合平面高度与观测线倒凹深度无直接决定关系。","tier":"进阶"},{"id":216,"type":"single","stem":"在全口义齿排牙时，若后牙排列偏向牙槽嵴顶的颊侧，最可能导致","options":["义齿翘动和脱位","义齿固位力增强","咀嚼效率提高","基托边缘密合度增加"],"answer":[0],"explanation":"知识点是人工牙排列位置与义齿稳定的关系。后牙偏向颊侧会使咬合力偏离牙槽嵴顶，形成杠杆作用，导致义齿翘动和脱位。偏向颊侧不会增强固位、提高咀嚼效率或改善基托边缘密合度。","tier":"进阶"},{"id":217,"type":"single","stem":"树脂基托表面出现细小气泡，最常见的原因是","options":["填塞树脂时压力不足","基托蜡型过厚","石膏模型未充分干燥","分离剂涂布过厚"],"answer":[0],"explanation":"知识点是树脂基托气泡的成因。填塞时压力不足会使树脂内气泡无法排出。蜡型过厚影响基托厚度而非气泡；模型未干燥主要影响分离剂成膜；分离剂过厚影响表面光洁度而非内部气泡。","tier":"进阶"},{"id":218,"type":"single","stem":"在调整全口义齿咬合时，发现正中颌位时后牙接触而前牙不接触，正确的处理是","options":["调磨后牙颌面高点","加高前牙切缘","降低后牙颌面高度","重新排列前牙"],"answer":[0],"explanation":"知识点是全口义齿咬合调整原则。正中颌位应前后牙均匀接触，后牙接触而前牙不接触时应调磨后牙颌面高点使前牙接触。加高前牙或降低后牙会破坏咬合关系；重新排列前牙不是首选处理。","tier":"挑战"},{"id":219,"type":"single","stem":"某加工厂在制作钴铬合金支架时，铸件表面出现较多砂眼，技术人员首先应检查的环节是","options":["铸造温度和铸模预热温度","模型观测线的确定","卡环臂的弯制角度","基托蜡型的厚度"],"answer":[0],"explanation":"知识点是铸造缺陷的原因分析。砂眼多与铸造温度、铸模预热温度及铸造压力有关。观测线、卡环弯制角度和蜡型厚度主要影响就位和外形，不是砂眼的首查环节。","tier":"进阶"},{"id":220,"type":"single","stem":"在制作可摘局部义齿时，患者模型上基牙倒凹较大，若设计为弯制卡环，正确的做法是","options":["选择弹性较好的钢丝并适当减小卡环臂进入倒凹的深度","选择较粗钢丝并增加卡环臂进入倒凹的深度","选择较粗钢丝并减小卡环臂进入倒凹的深度","选择弹性较好的钢丝并增加卡环臂进入倒凹的深度"],"answer":[0],"explanation":"知识点是倒凹较大时卡环的设计调整。倒凹大时应选弹性好的钢丝并适当减小进入倒凹深度，避免固位力过大导致取戴困难。较粗钢丝弹性差；增加进入深度会加大固位力，都不合适。","tier":"挑战"},{"id":221,"type":"single","stem":"在制作钴铬合金铸造支架时，模型上的固位体蜡型需要做倒凹缓冲，其目的是","options":["避免铸件在就位时刮伤基牙倒凹区","补偿合金铸造后的收缩变形量","预留粘接剂溢出通道","防止蜡型从模型上取下时断裂"],"answer":[0],"explanation":"知识点：固位体倒凹缓冲的作用。正确项对：缓冲后铸件进入倒凹时不刮伤基牙。错误项分析：补偿铸造收缩靠放尺而非倒凹缓冲；粘接剂溢出通道由排气沟提供；蜡型取下断裂与缓冲无关。","tier":"进阶"},{"id":222,"type":"single","stem":"制作全口义齿时，上颌模型后堤区的处理方式是","options":["在硬腭后缘处刮除少量石膏形成后堤沟","在腭中缝处加压形成隆起","在上颌结节处做凹陷缓冲","在切牙乳头处保留石膏突起"],"answer":[0],"explanation":"知识点：全口义齿后堤区处理。正确项对：后堤区刮除少量石膏，义齿基托在此形成后堤压迫软组织获得边缘封闭。错误项分析：腭中缝加压会形成不必要隆起；上颌结节缓冲用于骨突区；切牙乳头突起会压迫神经。","tier":"进阶"},{"id":223,"type":"single","stem":"在义齿加工中，使用石膏包埋铸造蜡型时，蜡型表面涂布表面张力降低剂的目的是","options":["使包埋材料能充分润湿蜡型表面","提高蜡型表面硬度防止变形","加快包埋材料的凝固速度","防止蜡型中的色素渗入包埋材"],"answer":[0],"explanation":"知识点：蜡型表面处理。正确项对：降低表面张力使包埋材润湿蜡型，避免气泡附着。错误项分析：表面张力降低剂不改变蜡型硬度；不影响包埋材凝固速度；与色素渗透无关。","tier":"进阶"},{"id":224,"type":"single","stem":"可摘局部义齿的模型观测中，就位道的确定主要影响","options":["卡环臂进入倒凹的深度","基托的厚度分布","人工牙的排列位置","印模材料的凝固时间"],"answer":[0],"explanation":"知识点：观测线与就位道关系。正确项对：就位道决定观测线位置，进而决定卡环臂进入倒凹的深度。错误项分析：基托厚度由基托设计决定；人工牙排列与就位道无关；印模凝固时间与观测无关。","tier":"进阶"},{"id":225,"type":"single","stem":"活动义齿弯制卡环时，卡环臂应进入基牙倒凹区的深度通常控制在","options":["0.25mm左右","0.75mm左右","1.25mm左右","1.75mm左右"],"answer":[0],"explanation":"知识点：弯制卡环倒凹深度。正确项对：钴铬合金弯制卡环一般进入0.25mm倒凹。错误项分析：0.75mm以上倒凹过深，就位困难且易变形；1.25mm和1.75mm更超出合理范围。","tier":"进阶"},{"id":226,"type":"single","stem":"在义齿加工厂制作全口义齿时，如果模型上颌后堤区石膏刮除过多，最可能造成的后果是","options":["义齿基托后缘压迫过深导致患者恶心","义齿基托后缘封闭不良导致固位力下降","义齿基托与腭部之间产生明显缝隙","义齿基托后缘容易折断"],"answer":[1],"explanation":"知识点：后堤区刮除量与边缘封闭的关系。正确项对：刮除过多使基托后堤压迫不足，封闭差、固位力下降。错误项分析：压迫过深是刮除过少或加压过多；产生缝隙是缓冲过度而非后堤区问题；折断与厚度和材料有关。","tier":"进阶"},{"id":227,"type":"single","stem":"铸造支架中，大连接体的主要功能是","options":["连接两侧鞍式义齿并分散咬合力","直接进入基牙倒凹提供固位","替代基托覆盖缺牙区黏膜","支撑人工牙排列位置"],"answer":[0],"explanation":"知识点：大连接体的功能。正确项对：大连接体连接各部件并将咬合力分散到基牙和黏膜。错误项分析：进入倒凹提供固位是卡环臂的功能；覆盖缺牙区黏膜是基托的功能；支撑人工牙是基托和小连接体的作用。","tier":"基础"},{"id":228,"type":"single","stem":"在义齿加工中，熔模铸造时铸圈内包埋材料的气泡未排出，最可能导致","options":["铸件表面出现金属瘤","铸件内部产生气孔","铸件尺寸整体缩水","铸件颜色发暗"],"answer":[1],"explanation":"知识点：包埋气泡对铸件质量的影响。正确项对：气泡附着在蜡型表面，铸造后形成铸件表面或内部气孔。错误项分析：金属瘤由铸道设计或包埋材开裂引起；整体缩水与合金收缩有关；颜色发暗与氧化或合金成分有关。","tier":"进阶"},{"id":229,"type":"single","stem":"某加工厂在制作钴铬支架时，铸件冷却后从铸圈中取出发现局部未铸满，铸造温度、合金量和铸道设计经复核均正常，下一步最应检查的环节是","options":["包埋材料的透气性是否足够","蜡型表面是否残留分离剂","铸圈是否在铸造前充分预热","合金是否在铸造前过热"],"answer":[0],"explanation":"知识点：铸造不全的原因排查。正确项对：包埋材透气性不足时气体无法排出，合金液不能充满铸腔。错误项分析：分离剂残留影响表面质量但不致铸不满；预热不足属温度问题但题干已排除温度因素；合金过热会氧化但不直接导致铸不满。","tier":"挑战"},{"id":230,"type":"multi","stem":"在全口义齿制作中，关于个别托盘制作的正确说法包括","options":["个别托盘边缘应比功能整塑线短2mm左右","托盘柄应避开唇系带和舌系带区域","个别托盘应在模型上预留1~2mm间隙容纳印模材","托盘底部应紧贴模型以增加强度","托盘边缘应延伸至黏膜转折处以上5mm"],"answer":[0,1,2],"explanation":"知识点：个别托盘制作要点。正确项对：边缘短2mm便于功能整塑；托盘柄避开系带避免干扰；预留间隙容纳印模材。错误项分析：底部紧贴模型会使印模材无处容纳；边缘超出转折处过多会压迫黏膜。","tier":"挑战"},{"id":231,"type":"single","stem":"在制作钴铬合金铸造支架时，模型上填倒凹所用的材料应具备的性能是","options":["加热后能软化流动并紧密贴合模型表面","固化后硬度高于石膏模型便于修整","固化后能被蜡液溶解以利后续除蜡","涂布后能渗透石膏模型内部增强强度"],"answer":[0],"explanation":"知识点：填倒凹材料的性能要求。正确项加热软化流动可紧贴模型，冷却后有一定强度且能被蜡液溶解或便于去除。错误项：固化后硬度高于石膏会难以修整且易损伤模型；能被蜡液溶解是除蜡要求而非填倒凹材料核心性能，且表述混淆了两类材料；渗透石膏内部增强强度并非填倒凹材料的功能，反而影响模型精度。","tier":"进阶"},{"id":232,"type":"single","stem":"制作全口义齿蜡基托时，基托边缘在唇颊系带处的处理方式是","options":["让开系带并形成切迹","覆盖系带并加压成形","与系带平齐不加修整","延伸到系带附着处并加厚"],"answer":[0],"explanation":"知识点：全口义齿基托边缘与系带的关系。正确项应在系带处形成让开切迹，保证系带活动自由。错误项：覆盖系带会限制系带运动导致压痛脱位；与系带平齐未让开，系带活动时仍会顶起基托；延伸到附着处并加厚会压迫系带附着结构。","tier":"进阶"},{"id":233,"type":"single","stem":"可摘局部义齿制作中，弯制卡环时对卡环臂的要求是","options":["卡环臂尖端进入倒凹区且与牙面贴合","卡环臂整体位于倒凹区外以便摘戴","卡环臂中部进入倒凹区尖端离开牙面","卡环臂与牙面保持均匀间隙不接触"],"answer":[0],"explanation":"知识点：弯制卡环的倒凹设计要求。正确项卡环臂尖端进入倒凹区、臂身与牙面贴合，才能兼顾固位与稳定。错误项：整体位于倒凹区外无固位作用；中部进入倒凹而尖端离开牙面无法有效固位；与牙面保持均匀间隙不接触则失去卡抱作用。","tier":"进阶"},{"id":234,"type":"single","stem":"在石膏模型上制作熔模时，蜡型表面出现局部凹陷，最可能的原因是","options":["蜡液温度过高导致收缩不均","模型表面分离剂涂布过厚","蜡型冷却速度过快","滴蜡时局部蜡量不足"],"answer":[3],"explanation":"知识点：熔模缺陷的原因分析。正确项滴蜡时局部蜡量不足会形成凹陷。错误项：蜡液温度过高主要造成蜡型变形或流散，不是局部凹陷的直接原因；分离剂过厚影响蜡与模型贴合和表面光洁，不形成局部凹陷；冷却过快引起收缩变形而非局部凹陷。","tier":"进阶"},{"id":235,"type":"single","stem":"铸造完成后，钴铬合金支架铸件表面出现粘砂，正确的处理方式是","options":["用喷砂机以适当压力喷砂清除","用高速车针直接磨除粘砂层","将铸件重新包埋后再铸造一次","用盐酸浸泡使粘砂层溶解脱落"],"answer":[0],"explanation":"知识点：铸件粘砂的清理方法。正确项喷砂可在不损伤铸件的前提下清除表面粘砂。错误项：高速车针直接磨除容易损伤铸件外形和精度；重新包埋铸造不解决粘砂问题且浪费材料；盐酸浸泡会腐蚀钴铬合金基体，不是清除粘砂的常规安全方法。","tier":"进阶"},{"id":236,"type":"single","stem":"制作全口义齿时，在石膏模型上铺蜡基托前对模型表面涂布分离剂的主要作用是","options":["防止蜡与石膏粘连便于取下蜡型","增加蜡的流动性使基托更均匀","提高石膏表面强度防止模型破损","使蜡基托表面更光滑减少打磨"],"answer":[0],"explanation":"知识点：分离剂在蜡型制作中的作用。正确项分离剂可防止蜡与石膏粘连，便于完整取下蜡型。错误项：分离剂不改变蜡的流动性；不提高石膏强度；也不直接改善蜡基托表面光洁度，表面光洁靠火焰吹光或修整。","tier":"基础"},{"id":237,"type":"single","stem":"可摘局部义齿的支托凹制备时，支托凹底与基牙长轴的关系应使支托传递的力","options":["沿基牙长轴方向传导","垂直于基牙长轴传导","与基牙长轴成45度传导","与基牙长轴成60度传导"],"answer":[0],"explanation":"知识点：支托凹的受力设计。正确项支托凹底应使𬌗力沿基牙长轴方向传导，减少对基牙的侧向力。错误项：垂直于长轴传导产生侧向力易致基牙损伤；45度、60度均偏离长轴方向，同样产生不利侧向力。","tier":"进阶"},{"id":238,"type":"single","stem":"在焊接义齿支架时，焊料熔化后未能充分流布于焊接间隙，最可能的原因是","options":["焊接间隙过小且加热温度不足","焊料用量过多覆盖了焊接区","被焊件表面过于粗糙","焊接时使用了还原焰"],"answer":[0],"explanation":"知识点：焊接质量的影响因素。正确项间隙过小阻碍毛细作用、温度不足使焊料流动性差，均导致流布不良。错误项：焊料过多主要造成堆积而非不流布；表面粗糙影响相对较小且不是主因；还原焰有利于防止氧化，不是阻碍流布的原因。","tier":"进阶"},{"id":239,"type":"single","stem":"在全口义齿排牙时，人工牙排列在牙槽嵴顶偏舌侧会导致","options":["义齿受力时易向唇侧翘动","义齿固位力明显增强","咀嚼效率显著提高","基托边缘封闭更严密"],"answer":[0],"explanation":"知识点：人工牙排列位置与义齿稳定的关系。正确项排牙偏舌侧使力点偏离牙槽嵴顶，受力时易向唇侧翘动。错误项：偏舌侧不利于固位；咀嚼效率不会因此提高；基托边缘封闭与排牙位置无直接关系。","tier":"进阶"},{"id":240,"type":"single","stem":"制作固定桥熔模时，桥体𬌗面蜡型加厚过多的直接后果是","options":["桥体金属过厚影响咬合空间","桥体与基牙连接强度下降","桥体组织面密合度提高","桥体表面粗糙度增加"],"answer":[0],"explanation":"知识点：固定桥熔模厚度控制。正确项桥体𬌗面蜡型过厚使铸造后金属过厚，占据咬合空间影响咬合。错误项：连接强度与连接区设计有关，不因桥体加厚而下降；组织面密合度取决于蜡型贴合而非厚度；表面粗糙度取决于蜡型表面处理而非厚度。","tier":"进阶"},{"id":241,"type":"single","stem":"制作钴铬合金铸造支架时，模型上需要先填补的倒凹区域应选用哪种材料更合适","options":["超硬石膏","熔模铸造蜡","磷酸盐包埋料","硅橡胶印模材"],"answer":[1],"explanation":"知识点是铸造支架制作中模型倒凹填补。正确项熔模铸造蜡可精确填补倒凹并便于后续缓冲处理。超硬石膏用于工作模型翻制而非倒凹填补；磷酸盐包埋料用于铸造包埋而非模型处理；硅橡胶印模材用于取模而非填补倒凹。","tier":"进阶"},{"id":242,"type":"single","stem":"可摘局部义齿支架在模型上设计时，观测线以下靠近缺隙侧的倒凹区通常用于","options":["放置卡环臂的固位段","放置支托的支撑段","放置大连接体的连接段","放置基托的覆盖段"],"answer":[0],"explanation":"知识点是观测线与卡环设计。正确项为卡环臂固位段进入倒凹区起固位作用。支托放置在𬌗面或舌面支托窝内不进入倒凹；大连接体放置在非倒凹区；基托覆盖区与倒凹固位无关。","tier":"进阶"},{"id":243,"type":"single","stem":"在全口义齿蜡型制作中，后堤区需要适当加厚蜡型的目的是","options":["增强基托边缘的封闭效果","提高人工牙的排列高度","增加基托的厚度均匀性","便于义齿的打磨抛光"],"answer":[0],"explanation":"知识点是全口义齿后堤区处理。正确项为后堤区加厚有助于基托边缘与软组织紧密贴合形成边缘封闭。排列高度由𬌗平面决定；厚度均匀性要求恰好是避免局部过厚；打磨抛光在蜡型完成后进行。","tier":"进阶"},{"id":244,"type":"single","stem":"固定桥制作中，代型上涂布间隙漆（die spacer）的主要作用是","options":["增加金属与代型之间的粘接强度","为粘接剂预留均匀的间隙空间","防止铸造时金属收缩变形","提高烤瓷与金属的结合力"],"answer":[1],"explanation":"知识点是固定修复体代型间隙处理。正确项为间隙漆为粘接剂提供均匀空间，保证修复体就位。间隙漆不增加粘接强度；铸造收缩由包埋材料膨胀补偿；瓷金结合力由金瓷界面处理决定。","tier":"基础"},{"id":245,"type":"single","stem":"制作活动义齿时，弯制卡环的钢丝通常选用的材料是","options":["纯钛丝","钴铬合金丝","不锈钢丝","镍钛合金丝"],"answer":[2],"explanation":"知识点是弯制卡环用材。正确项为不锈钢丝具有合适弹性与成型性，是弯制卡环常用材料。纯钛丝弹性模量低不易提供足够固位力；钴铬合金丝多用于铸造而非弯制；镍钛合金丝超弹性不适合常规弯制卡环。","tier":"基础"},{"id":246,"type":"single","stem":"在石膏模型上分离模型时，使用石膏锯锯开代型沟的正确深度应达到","options":["仅切开模型表面石膏层","达到模型底面但保留底座","切至代型底部以下2厘米","切穿模型底座完全分离"],"answer":[1],"explanation":"知识点是代型分离操作。正确项为锯至模型底面但保留底座，保证代型可复位且不散失。仅切表面无法分离代型；切至底部以下会破坏底座；完全切穿会导致代型无法精确复位。","tier":"进阶"},{"id":247,"type":"single","stem":"铸造完成后，钴铬合金铸件从包埋材料中取出时最应注意的操作要点是","options":["趁热立即投入冷水中急冷","待完全冷却后再缓慢取出","在高温下用冷水喷淋降温","取出后立即用砂纸打磨表面"],"answer":[1],"explanation":"知识点是铸件冷却与取出。正确项为待完全冷却后取出，避免急冷导致铸件变形或裂纹。趁热急冷会产生热应力变形；高温冷水喷淋同样导致急冷缺陷；立即打磨会损伤未清理的铸件表面且不安全。","tier":"进阶"},{"id":248,"type":"single","stem":"烤瓷熔附金属修复体中，金属基底表面进行喷砂处理的主要目的是","options":["增加金属表面的粗糙度以提高瓷金结合","去除金属表面的氧化膜以提高导电性","降低金属的热膨胀系数以匹配瓷层","增加金属的厚度以补偿铸造收缩"],"answer":[0],"explanation":"知识点是瓷金结合界面处理。正确项为喷砂增加粗糙度，增大结合面积和机械嵌合。喷砂目的不是提高导电性；热膨胀系数由合金成分决定；喷砂不增加金属厚度。","tier":"进阶"},{"id":249,"type":"single","stem":"某技师在制作可摘局部义齿时发现支架试戴后基牙处有明显压痛点，最可能的原因是","options":["卡环臂进入倒凹过深","支托窝预备不足导致支托悬空","基托边缘伸展过度","连接体放置位置偏龈方"],"answer":[1],"explanation":"知识点是支架压痛原因分析。正确项为支托窝预备不足使支托不能就位而悬空，咬合时压迫基牙产生疼痛。卡环过深主要影响固位和取戴；基托边缘过度影响黏膜；连接体位置偏龈方影响舒适但不直接造成基牙压痛点。","tier":"挑战"},{"id":250,"type":"single","stem":"某加工厂在铸造一副钴铬合金支架时，发现铸件表面出现较多球形金属颗粒，最可能的原因是","options":["铸圈焙烧温度过低","铸造时熔金温度过高","包埋材料粉液比过大","铸圈焙烧时间过长"],"answer":[1],"explanation":"知识点是铸造缺陷判断。正确项为熔金温度过高使合金过热，流动性过大产生球状颗粒附着。焙烧温度过低导致铸件不全；粉液比过大会降低包埋材料透气性；焙烧时间过长会使铸圈温度过高但一般表现为铸件表面粗糙而非球形颗粒。","tier":"挑战"},{"id":251,"type":"single","stem":"在全口义齿排牙时，前牙排列应使切导斜面与𬌗平面之间的关系为","options":["切导斜面与𬌗平面平行","切导斜面与𬌗平面形成适当角度","切导斜面垂直于𬌗平面","切导斜面与𬌗平面重合"],"answer":[1],"explanation":"知识点是全口义齿前牙排列与𬌗平面关系。正确项为切导斜面与𬌗平面形成适当角度，有利于前伸𬌗平衡。平行或重合不能满足前伸运动平衡；垂直则角度过大影响美观和功能。","tier":"进阶"},{"id":252,"type":"single","stem":"制作钴铬合金支架可摘局部义齿时，模型经琼脂复制后灌注耐火材料模型，其目的主要是为了满足后续哪项工艺的要求","options":["在耐火模型上直接进行蜡型制作并高温铸造","在耐火模型上完成支架的电解抛光处理","在耐火模型上试排人工牙并调整咬合","在耐火模型上进行基托树脂的加压充填"],"answer":[0],"explanation":"知识点：耐火材料模型在钴铬合金支架制作中的用途。钴铬合金熔点高，需失蜡铸造，耐火模型可承受铸造高温，故用于蜡型制作和铸造。错误项B电解抛光在金属支架铸件完成后进行，不在耐火模型上；错误项C试排牙通常在石膏工作模型上完成；错误项D树脂充填是在石膏模型上完成，与耐火模型无关。","tier":"挑战"},{"id":253,"type":"single","stem":"在可摘局部义齿蜡型制作中，卡环臂进入倒凹区的深度通常应控制在","options":["0.25mm左右","0.75mm左右","1.25mm左右","2.00mm左右"],"answer":[0],"explanation":"知识点：卡环臂倒凹深度的常规设计。钴铬合金铸造卡环通常进入0.25mm倒凹，以保证固位力合适且不易变形。错误项B 0.75mm多见于弯制钢丝卡环的倒凹设计；错误项C 1.25mm倒凹过深，就位困难且易使卡环永久变形；错误项D 2.00mm过深，会导致卡环折断或患者摘戴困难。","tier":"进阶"},{"id":254,"type":"single","stem":"制作全口义齿时，在石膏模型上铺蜡堤并确定颌位关系后，下一步进入装盒前的常规工序是","options":["在模型上直接装盒并充填树脂","先上颌架再制作蜡型基托","先将模型浸泡于沸水中去除蜡堤","先对石膏模型进行真空搅拌"],"answer":[1],"explanation":"知识点：全口义齿制作流程。确定颌位关系后应上颌架，再制作蜡型基托，然后装盒。错误项A未上颌架直接装盒，无法保证咬合关系；错误项C去除蜡堤应在装盒、去蜡阶段进行，而非刚确定颌位关系后；错误项D真空搅拌是调拌石膏或树脂时的操作，不是该环节的工序。","tier":"进阶"},{"id":255,"type":"single","stem":"在活动义齿基托树脂加热固化过程中，采用水浴加热法时，从室温升至100℃应缓慢进行，其主要目的是","options":["防止树脂内气泡因升温过快而集中逸出","避免石膏模型因温差过大而开裂","减少树脂单体在高温下的挥发损失","防止基托与模型分离导致变形"],"answer":[0],"explanation":"知识点：基托树脂水浴加热固化工艺。缓慢升温可使树脂内部气泡逐渐排出，避免气泡集中逸出造成基托内部缺陷。错误项B石膏模型在水中加热，开裂主要与升温过快引起的热应力有关，但这不是缓慢升温的首要目的；错误项C单体挥发主要发生在面团期操作阶段；错误项D基托与模型分离与升温速度无直接因果关系。","tier":"进阶"},{"id":256,"type":"single","stem":"制作铸造金属全冠蜡型时，在邻面接触区蜡型应恢复的接触状态是","options":["紧密接触且接触区位于邻面中1/3偏颊侧","轻微接触且接触区位于邻面中1/3偏舌侧","紧密接触且接触区位于邻面切1/3","轻微接触且接触区位于邻面龈1/3"],"answer":[0],"explanation":"知识点：全冠邻面接触区的正确位置与紧密程度。后牙邻面接触区应位于邻面中1/3偏颊侧，接触紧密以防止食物嵌塞。错误项B偏舌侧不符合后牙接触区常规位置；错误项C切1/3位置过高，不符合邻面接触区解剖；错误项D龈1/3位置过低，易压迫牙龈且接触不良。","tier":"进阶"},{"id":257,"type":"single","stem":"在制作可摘局部义齿时，下列哪项属于间接固位体的主要作用","options":["防止义齿沿支点线转动和翘动","直接卡抱基牙提供固位力","恢复缺失牙的咀嚼功能","连接义齿各组成部分并分散应力"],"answer":[0],"explanation":"知识点：间接固位体的功能。间接固位体主要防止义齿沿支点线旋转、翘动，起稳定作用。错误项B直接卡抱基牙提供固位力的是直接固位体（卡环）；错误项C恢复咀嚼功能是人工牙的作用；错误项D连接各部件并分散应力是大连接体的作用。","tier":"进阶"},{"id":258,"type":"single","stem":"在义齿加工中，对钴铬合金铸件进行喷砂处理时，常用的喷砂材料是","options":["氧化铝砂","石英砂","玻璃微珠","金刚砂"],"answer":[0],"explanation":"知识点：钴铬合金铸件喷砂材料。钴铬合金硬度高，常用氧化铝砂进行喷砂清理铸件表面。错误项B石英砂多用于石膏模型或较软金属的清理；错误项C玻璃微珠多用于钛及钛合金等较软金属表面处理；错误项D金刚砂硬度虽高但颗粒形状和粒度不适合常规义齿喷砂。","tier":"进阶"},{"id":259,"type":"single","stem":"在全口义齿排牙时，上颌前牙的排列应使切导斜面与下颌前牙形成适当的覆合覆盖，其主要目的是","options":["保证前伸合时后牙能均匀接触","有利于患者发音清晰","防止义齿基托边缘过长","便于义齿装盒时蜡型固定"],"answer":[0],"explanation":"知识点：全口义齿前牙覆合覆盖与咬合平衡的关系。适当覆合覆盖可使前伸合时后牙保持接触，实现前伸平衡。错误项B发音主要与前牙位置和基托形态有关，但不是覆合覆盖设计的首要目的；错误项C基托边缘长度与覆合覆盖无直接关系；错误项D蜡型固定与覆合覆盖设计无关。","tier":"进阶"},{"id":260,"type":"single","stem":"在义齿加工厂制作树脂基托时，装盒后去蜡的正确操作是","options":["待蜡型硬化后打开型盒，用沸水冲净残蜡","趁蜡型尚软时打开型盒，用冷水冲出蜡","装盒后立即打开型盒，用酒精擦去蜡","装盒后冷却至室温，用刀片刮除蜡"],"answer":[0],"explanation":"知识点：树脂基托装盒去蜡工艺。装盒后待蜡硬化，打开型盒用沸水冲净残蜡，保证型腔清洁。错误项B蜡未硬化时打开型盒会破坏型腔；错误项C装盒后立即打开，石膏未凝固，型腔易损坏；错误项D用刀片刮蜡难以彻底清除且易损伤石膏型腔。","tier":"进阶"},{"id":261,"type":"single","stem":"某加工厂制作钴铬合金支架时，铸件完成后发现局部卡环臂有缩孔，经查熔铸温度正常、铸圈焙烧充分，则最可能的原因是","options":["铸造时铸圈温度下降过快导致金属液流动性不足","铸造压力过大使金属液产生湍流","合金中碳含量偏低导致熔点升高","铸道直径过大导致金属液流速过慢"],"answer":[0],"explanation":"知识点：钴铬合金铸造缩孔的原因分析。铸圈温度下降过快会使金属液流动性不足，产生缩孔。错误项B压力过大主要引起湍流和卷气，不是缩孔的典型原因；错误项C碳含量偏低会提高熔点，但题目已说明熔铸温度正常；错误项D铸道直径过大一般不会导致缩孔，反而有利于充填。","tier":"挑战"},{"id":262,"type":"single","stem":"制作钴铬合金铸造支架时，模型上用于形成支架与组织面之间缓冲间隙的薄片材料应放置在何处","options":["缺牙区牙槽嵴顶的石膏表面","基牙邻面倒凹区的石膏表面","上颌硬区及下颌舌隆突的石膏表面","工作模型底座与代型之间的分离面上"],"answer":[2],"explanation":"知识点是铸造支架缓冲间隙的设置部位。正确项对：上颌硬区、下颌舌隆突等骨隆突区需缓冲，避免支架压迫黏膜。错误项错在：缺牙区牙槽嵴顶是支架主要承托区，不应缓冲；基牙邻面倒凹区是卡环进入区，不是缓冲区；模型底座分离面与缓冲无关。","tier":"进阶"},{"id":263,"type":"single","stem":"用蜡片制作上颌全口义齿蜡基托时，蜡基托边缘在唇颊系带处应做成什么形态","options":["与系带紧张方向垂直的锐利边缘","避开系带并形成切迹让开","覆盖系带并稍加厚缓冲","与系带走行方向一致的薄边"],"answer":[1],"explanation":"知识点是全口义齿基托边缘在系带区的处理。正确项对：系带活动需让开，形成切迹。错误项错在：垂直锐利边缘会刺激系带；覆盖系带加厚会限制系带活动；与系带走行一致的薄边仍会妨碍系带功能。","tier":"进阶"},{"id":264,"type":"single","stem":"在可摘局部义齿模型上弯制卡环时，卡环臂进入基牙倒凹的深度一般应控制在多少","options":["0.25mm左右","1.0mm左右","1.5mm左右","2.0mm左右"],"answer":[0],"explanation":"知识点是铸造或弯制卡环的倒凹深度。正确项对：钴铬合金卡环臂通常进入0.25mm倒凹。错误项错在：1.0mm、1.5mm、2.0mm倒凹过深，会导致卡环臂进入过深、取戴困难并损伤基牙。","tier":"进阶"},{"id":265,"type":"single","stem":"在石膏模型上确定可摘局部义齿的就位道时，采用平均倒凹法的主要目的是什么","options":["使各基牙倒凹深度完全一致","兼顾各基牙倒凹使义齿取戴方便","让模型倾斜到倒凹最大侧","消除所有基牙的倒凹"],"answer":[1],"explanation":"知识点是就位道选择中的平均倒凹法。正确项对：通过模型倾斜兼顾各基牙倒凹，便于取戴。错误项错在：倒凹深度不可能完全一致；倾斜到最大侧会使就位困难；消除全部倒凹则卡环无固位作用。","tier":"基础"},{"id":266,"type":"single","stem":"铸造全冠蜡型在颈缘处需要做哪种处理以补偿合金铸造收缩","options":["颈缘蜡型加厚并外扩","颈缘蜡型减薄并内收","在颈缘处加放铸造收缩补偿蜡","颈缘蜡型与代型完全贴合不加处理"],"answer":[2],"explanation":"知识点是蜡型对铸造收缩的补偿。正确项对：颈缘加放补偿蜡可抵消合金冷却收缩。错误项错在：加厚外扩会破坏边缘密合；减薄内收会造成边缘过薄；完全贴合不补偿会导致铸件边缘收缩不密合。","tier":"进阶"},{"id":267,"type":"single","stem":"制作可摘局部义齿时，模型观测后确定基牙倒凹，若观测杆与牙长轴平行，此时基牙近远中面倒凹的分布特点是什么","options":["近中面倒凹大于远中面","远中面倒凹大于近中面","近远中面倒凹量基本相等","近远中面均无倒凹"],"answer":[2],"explanation":"知识点是模型观测中观测杆方向与倒凹分布的关系。正确项对：观测杆与牙长轴平行时，近远中面倒凹基本对称。错误项错在：近中或远中倒凹单侧偏大见于观测杆倾斜时；均无倒凹则卡环无法固位。","tier":"挑战"},{"id":268,"type":"single","stem":"制作个别托盘时，在石膏模型上铺自凝树脂前涂分离剂的主要目的是什么","options":["增加树脂与模型的粘接强度","防止树脂与模型粘连便于取下","使树脂表面更光滑","加快树脂固化速度"],"answer":[1],"explanation":"知识点是个别托盘制作中分离剂的作用。正确项对：分离剂形成隔离膜，便于托盘从模型取下。错误项错在：分离剂降低粘接而非增加；不负责表面光滑；不加快固化。","tier":"基础"},{"id":269,"type":"single","stem":"在可摘局部义齿设计中，当基牙牙冠较短、固位形差时，常采取的措施是什么","options":["增加卡环臂长度以增加固位","减少卡环数量以减轻基牙负担","设计RPI卡环组以分散he力","将卡环臂放在非倒凹区"],"answer":[0],"explanation":"知识点是短冠基牙的固位设计。正确项对：牙冠短时可增加卡环臂长度以增加弹性固位。错误项错在：减少卡环数量会降低固位；RPI卡环组适用于游离端而非短冠固位；放在非倒凹区无固位作用。","tier":"基础"},{"id":270,"type":"multi","stem":"在制作可摘局部义齿时，下列哪些情况需要在模型上做缓冲处理","options":["上颌硬区骨隆突处","下颌舌隆突处","基牙舌侧倒凹区","缺牙区牙槽嵴顶承托区"],"answer":[0,1],"explanation":"知识点是义齿缓冲区的识别。正确项对：上颌硬区、下颌舌隆突等骨隆突区需缓冲。错误项错在：基牙舌侧倒凹区是卡环进入区不需缓冲；缺牙区牙槽嵴顶是承托区不应缓冲。","tier":"挑战"},{"id":271,"type":"single","stem":"在制作钴铬合金支架可摘局部义齿时，模型上需要填补的倒凹通常采用哪种材料最为合适","options":["超硬石膏","熔模铸造蜡","光固化树脂","磷酸盐包埋料"],"answer":[1],"explanation":"知识点：支架铸造前需用铸造蜡填补模型倒凹，便于后续翻制耐火模型。铸造蜡具有适当硬度和可塑性，能精确填补倒凹且翻制后易于清理。超硬石膏是灌注工作模的材料，不能用于填补倒凹；光固化树脂硬化后难以从耐火模型上清除干净；磷酸盐包埋料是铸造包埋材料，不能用于填补倒凹。","tier":"进阶"},{"id":272,"type":"single","stem":"固定桥熔模在铸造前进行脱蜡时，铸圈升温速度过快最可能导致的是","options":["铸件表面粗糙","铸件内部气孔增多","铸件边缘出现飞边","铸件产生变形或裂纹"],"answer":[3],"explanation":"知识点：脱蜡升温速度影响铸型完整性和铸件精度。升温过快会使铸型内水分和蜡料急剧汽化膨胀，导致铸型壁开裂或铸件变形。铸件表面粗糙多与包埋材料粒度或调拌比例有关；内部气孔多与铸造时排气不畅或熔金温度有关；边缘飞边多与铸型间隙过大有关，均非升温过快的主要后果。","tier":"进阶"},{"id":273,"type":"single","stem":"在全口义齿排牙时，上前牙的切缘应位于","options":["与下前牙切缘完全接触","略向唇侧超出下前牙","位于下前牙唇侧稍前方","与下前牙切缘形成浅覆浅覆盖"],"answer":[3],"explanation":"知识点：全口义齿前牙排列需形成适当的覆覆盖关系。浅覆浅覆盖有利于美观和功能，避免前伸运动时干扰。上下切缘完全接触会形成过深覆，妨碍下颌前伸；略向唇侧超出下前牙不符合正常覆盖关系；下前牙唇侧稍前方则形成反关系，均为错误排列方式。","tier":"基础"},{"id":274,"type":"single","stem":"可摘局部义齿基托蜡型完成后，装盒时最需要注意的操作要点是","options":["蜡型表面涂布分离剂后立即装盒","石膏灌注时先灌注牙冠部分再灌注基托部分","蜡型完全冷却后涂布分离剂再装盒","将蜡型直接放入型盒下层后灌注石膏"],"answer":[2],"explanation":"知识点：装盒前蜡型需冷却定型并涂布分离剂，防止石膏与蜡型粘连。蜡型未冷却即装盒会导致变形；分离剂涂布后需等待其干燥成膜再灌注石膏，立即装盒会使分离剂失效；石膏灌注顺序应先去气泡再整体灌注，先灌牙冠再灌基托并非关键要点且操作上易产生气泡。","tier":"进阶"},{"id":275,"type":"single","stem":"某技师在打磨钴铬合金支架时，发现铸件表面出现许多细小凹坑，最可能的原因是","options":["铸造时熔金温度过高","包埋材料调拌时液粉比过大","铸型升温过快导致铸型开裂","铸造压力不足或铸型透气性差"],"answer":[3],"explanation":"知识点：铸件表面凹坑多因铸造时金属液未能完全充满铸型所致。铸造压力不足或铸型透气性差会使金属液充填不全形成凹坑。熔金温度过高会导致铸件表面粗糙或氧化；包埋材料液粉比过大会降低铸型强度；铸型升温过快会导致铸型开裂，与表面凹坑的直接成因不同。","tier":"挑战"},{"id":276,"type":"single","stem":"在制作树脂基托可摘局部义齿时，热处理后开盒取出的基托出现气泡，最可能的原因是","options":["充填树脂时压力过大","热处理时升温过快","树脂粉液比中液体过多","开盒时基托尚未完全冷却"],"answer":[2],"explanation":"知识点：树脂基托气泡多因粉液比例不当或充填不足所致。液体过多会使树脂聚合收缩增大、产生气泡。充填时压力过大会使树脂溢出而非产生气泡；热处理升温过快主要导致树脂变色或变形；开盒时未冷却主要导致基托变形而非气泡。","tier":"进阶"},{"id":277,"type":"single","stem":"某技师在制作金属烤瓷冠时，发现瓷层与金属基底之间出现剥脱，检查发现金属表面处理时使用了不当的磨料，最可能影响结合力的环节是","options":["金属表面粗糙度过大","金属表面残留有油脂","金属表面氧化层过厚","金属表面喷砂后放置时间过长"],"answer":[1],"explanation":"知识点：金属烤瓷结合力依赖于金属表面的清洁度和适当粗糙度。表面残留油脂会直接阻碍瓷与金属的化学结合和机械嵌合。粗糙度过大反而有利于结合；氧化层过厚可通过打磨去除，并非使用不当磨料的直接后果；喷砂后放置时间过长虽会污染表面，但题目强调的是磨料本身的问题，油脂污染更为直接。","tier":"挑战"},{"id":278,"type":"single","stem":"在弯制活动义齿卡环时，卡环臂进入倒凹的深度一般应控制在","options":["0.1mm以内","0.25mm左右","0.5mm左右","0.75mm左右"],"answer":[1],"explanation":"知识点：卡环臂进入倒凹的深度需根据卡环类型和基牙条件确定，钴铬合金铸造卡环一般为0.25mm左右，既能提供固位力又不过大。0.1mm固位力不足；0.5mm和0.75mm进入倒凹过深，会导致取戴困难并损伤基牙。","tier":"进阶"},{"id":279,"type":"single","stem":"全口义齿基托边缘在唇颊系带处的处理方式应为","options":["基托边缘紧贴系带根部","基托边缘覆盖系带表面","基托边缘让开系带并形成切迹","基托边缘在此处加厚增强固位"],"answer":[2],"explanation":"知识点：基托边缘在系带处应形成切迹让开系带，避免系带活动时推动义齿脱位。紧贴系带根部会限制系带活动；覆盖系带表面会压迫系带；加厚边缘在此处无法增强固位反而影响功能运动，均为错误处理。","tier":"进阶"},{"id":280,"type":"single","stem":"某技师在制作固定桥时，发现桥体龈端与牙槽嵴黏膜之间接触过紧，最可能导致的问题是","options":["桥体自洁作用增强","桥体龈端黏膜受压萎缩","桥体与基牙连接处应力集中","桥体金属部分暴露"],"answer":[1],"explanation":"知识点：桥体龈端与黏膜应保持适当接触或轻微接触，过紧会压迫黏膜导致萎缩。自洁作用增强是错误的，过紧接触反而影响自洁；应力集中多与连接体设计有关；金属暴露与桥体龈端接触无关。","tier":"挑战"},{"id":281,"type":"single","stem":"在制作可摘局部义齿时，模型观测线的作用是","options":["确定基牙的牙冠外形高点","确定卡环臂的走向和倒凹位置","确定基托的伸展范围","确定咬合记录的高度"],"answer":[1],"explanation":"知识点：模型观测线用于确定基牙倒凹区和非倒凹区，指导卡环设计和就位道选择。确定牙冠外形高点、基托伸展范围和咬合记录高度均不是观测线的直接功能，分别由其他测量和记录方法完成。","tier":"基础"},{"id":282,"type":"multi","stem":"在制作钴铬合金铸造支架时，下列哪些操作有助于减少铸件内部气孔的产生","options":["适当提高铸造压力","保证铸型有良好的透气性","降低熔金温度至合金熔点附近","铸造前充分预热铸型","增加包埋材料的液粉比"],"answer":[0,1,3],"explanation":"知识点：铸件内部气孔与铸造压力、铸型透气性和预热温度密切相关。适当提高铸造压力有助于金属液充满铸型；良好透气性利于气体排出；充分预热铸型可减少气体残留。降低熔金温度至合金熔点附近会使金属液流动性不足，反而增加气孔；增加包埋材料液粉比会降低铸型透气性，不利于排气。","tier":"挑战"},{"id":283,"type":"single","stem":"制作钴铬合金铸造支架时，模型上填倒凹用的材料应选择","options":["超硬石膏","铸造蜡","弹性打样膏","琼脂印模材"],"answer":[1],"explanation":"知识点：铸造支架填倒凹材料。铸造蜡可精确塑形且高温烧失无残留，是填倒凹的规范材料。超硬石膏用于工作模型翻制而非填倒凹；弹性打样膏多用于复制模型；琼脂印模材用于取模，均不能填倒凹。","tier":"基础"},{"id":284,"type":"single","stem":"可摘局部义齿弯制卡环时，不锈钢丝在模型上弯制前应进行的处理是","options":["退火软化","淬火硬化","酸洗去氧化皮","电解抛光"],"answer":[0],"explanation":"知识点：不锈钢丝弯制前处理。弯制卡环前需退火降低弹性便于成形，弯制后再硬化处理。淬火会使钢丝变脆易断；酸洗与电解抛光属于表面处理，不解决弯制困难。","tier":"进阶"},{"id":285,"type":"single","stem":"全口义齿排牙时，上颌后牙牙合平面应位于","options":["与瞳孔连线平行","与鼻翼耳屏线平行","与下颌牙槽嵴顶平行","与眶耳平面平行"],"answer":[1],"explanation":"知识点：全口义齿牙合平面定位。牙合平面前部与瞳孔连线平行，后部与鼻翼耳屏线平行，临床以后部标志为主要参考。瞳孔连线仅作前部参考；下颌牙槽嵴顶与眶耳平面均非牙合平面定位标准。","tier":"基础"},{"id":286,"type":"single","stem":"制作烤瓷熔附金属冠时，金属基底冠的瓷结合面喷砂处理应选用的磨料是","options":["石英砂","氧化铝砂","玻璃珠","碳化硅砂"],"answer":[1],"explanation":"知识点：金属烤瓷结合面处理。氧化铝砂喷砂可形成均匀粗糙面且不污染金属表面，利于瓷金结合。石英砂与碳化硅砂硬度及洁净度不适宜；玻璃珠用于抛光而非粗化。","tier":"进阶"},{"id":287,"type":"single","stem":"热凝树脂基托聚合完成后，开盒取出的基托出现大量气泡，最可能的原因是","options":["充填树脂时压力不足","热处理时升温过快","基托蜡型过厚","分离剂涂布过少"],"answer":[1],"explanation":"知识点：热凝树脂气泡成因。升温过快使树脂外层先聚合，内层单体汽化无法逸出形成气泡。充填压力不足主要导致缺损或孔隙；蜡型过厚与分离剂过少分别影响厚度与分离，不直接产生大量气泡。","tier":"进阶"},{"id":288,"type":"single","stem":"可摘局部义齿支架铸造后，发现卡环臂与模型之间有明显间隙，最可能的原因是","options":["模型填倒凹过多","卡环蜡型过细","铸造时合金温度过低","包埋材料膨胀过大"],"answer":[0],"explanation":"知识点：卡环与模型密合度。填倒凹过多会使蜡型离开模型表面，铸件与牙面产生间隙。蜡型过细影响强度；合金温度低易浇不足；包埋膨胀过大使铸件偏大而非产生间隙。","tier":"挑战"},{"id":289,"type":"single","stem":"某加工厂制作钴铬合金支架，铸件表面出现较多圆形孔洞，检查发现合金熔炼时未充分脱氧，下一步最合理的处置是","options":["提高铸造压力重新铸造","加入适量脱氧剂并重新熔炼","降低包埋材料粉液比","延长铸圈冷却时间"],"answer":[1],"explanation":"知识点：铸造缺陷与合金熔炼。未脱氧导致气体滞留形成气孔，应加脱氧剂并重新熔炼。提高压力不能消除气体来源；粉液比与冷却时间影响膨胀与收缩，与气孔成因无关。","tier":"挑战"},{"id":290,"type":"single","stem":"全口义齿基托边缘在唇颊沟处应伸展至","options":["黏膜转折处","前庭沟底","系带附着处","牙槽嵴顶"],"answer":[1],"explanation":"知识点：全口义齿基托边缘伸展。唇颊沟处基托边缘应达前庭沟底以获得良好封闭。黏膜转折处过于保守；系带附着处需缓冲避让；牙槽嵴顶为承托区非边缘位置。","tier":"基础"},{"id":291,"type":"single","stem":"焊接可摘局部义齿支架时，为防止焊接变形，常采用的方法是","options":["先焊一侧再焊另一侧","整体加热后一次焊接","固定后分段对称焊接","焊接后立即淬火"],"answer":[2],"explanation":"知识点：支架焊接防变形。固定后分段对称焊接可使应力均匀分布，减少变形。先焊一侧或整体加热易产生不对称收缩；焊后淬火会增大脆性与变形风险。","tier":"进阶"},{"id":292,"type":"single","stem":"制作全口义齿时，模型在石膏硬化后需进行修整，其目的是","options":["增加模型强度","形成基托边缘的界限","便于分离剂涂布","减小模型体积便于装盒"],"answer":[1],"explanation":"知识点：全口义齿模型修整。修整模型边缘形成基托的边界与厚度参考。增加强度靠材料与操作；分离剂涂布与体积减小均非修整的主要目的。","tier":"进阶"},{"id":293,"type":"single","stem":"在制作钴铬合金铸造支架时，模型上的工作区蜡型完成后需要安插铸造，关于铸造安插位置的选择，下列做法正确的是","options":["铸造安插在支架最厚大处并避开网状结构","铸造安插在网状结构中央以便金属流动","铸造安插在卡环尖端以便补偿收缩","铸造安插在上腭板边缘最薄处"],"answer":[0],"explanation":"知识点：铸造安插位置与金属流动、收缩补偿的关系。铸造应设在蜡型最厚大且远离精细结构处，使金属液流畅充填并利于补缩；安插在网状结构中央会冲刷网孔并造成变形；安插在卡环尖端会使精细卡环过热变形；安插在上腭板最薄处无法提供足够补缩且易产生铸造缺陷。","tier":"进阶"},{"id":294,"type":"single","stem":"用自凝树脂制作个别托盘时，在模型上铺树脂前涂布分离剂的主要作用是","options":["防止树脂与模型粘连便于取下托盘","加速树脂的聚合固化速度","增加托盘表面与印模材料的结合力","降低树脂聚合时的产热峰值"],"answer":[0],"explanation":"知识点：分离剂在自凝树脂个别托盘制作中的作用。分离剂在模型与树脂之间形成隔离膜，使固化后的托盘易于从模型取下且不损坏模型；它不参与树脂聚合反应，不能加速固化；个别托盘与印模材料的结合靠托盘表面的固位结构而非分离剂；产热峰值由树脂用量和聚合条件决定，与分离剂无关。","tier":"基础"},{"id":295,"type":"single","stem":"在可卸代型技术中，制作代型时需要在模型上锯开分离代型，关于锯开线的走行要求，正确的是","options":["锯开线应外展并与牙长轴方向一致","锯开线应内收并偏向邻牙方向","锯开线应水平横穿牙根中部","锯开线应与牙长轴垂直呈直角"],"answer":[0],"explanation":"知识点：可卸代型锯开线的方向要求。锯开线需与牙长轴方向一致并略向外展，这样代型才能顺利从模型上取出和复位，且复位后位置稳定；内收偏向邻牙会损坏邻牙代型并使复位困难；水平横穿牙根中部会破坏代型固位；与牙长轴垂直会与就位道方向冲突，代型无法取出。","tier":"进阶"},{"id":296,"type":"single","stem":"在弯制不锈钢丝卡环时，需要在不锈钢丝上形成卡环臂的弧度，下列操作有利于防止钢丝折断的是","options":["弯制时用弯丝钳夹持并缓慢均匀用力","在钢丝上先用刻痕标记弯制点","弯制前将钢丝局部加热至发红","一次弯制到位不作停顿"],"answer":[0],"explanation":"知识点：不锈钢丝弯制的力学要求。缓慢均匀用力可让钢丝内部应力逐步释放，避免应力集中导致折断；刻痕会形成应力集中点反而易折断；不锈钢丝局部加热至发红会改变其力学性能和组织结构；一次弯制到位不作停顿容易造成急弯处应力集中而折断。","tier":"挑战"},{"id":297,"type":"single","stem":"在制作全口义齿蜡基托时，蜡基托边缘的厚度和形态应","options":["边缘圆钝并略厚于基托其他部位","边缘锐薄以便贴合黏膜转折","边缘与基托中部厚度完全一致","边缘呈阶梯状便于抛光"],"answer":[0],"explanation":"知识点：全口义齿蜡基托边缘的形态要求。蜡基托边缘应圆钝并稍厚，这样装盒后形成树脂基托边缘有一定厚度，能与黏膜转折处密合并有良好封闭；边缘锐薄会在装盒或打磨中缺损且封闭不良；边缘与中部等厚不符合基托边缘需稍厚的形态要求；阶梯状边缘无法与黏膜贴合且易积存食物。","tier":"进阶"},{"id":298,"type":"single","stem":"某技师在装盒时发现石膏灌注后个别牙位人工牙浮起，造成该人工牙颈缘与蜡型分离，最可能的原因是","options":["装盒时石膏灌注过急或人工牙未充分固定","分离剂涂布过厚使人工牙滑动","蜡型表面残留分离剂过多","石膏水粉比偏大导致石膏过稀"],"answer":[0],"explanation":"知识点：装盒工艺中人工牙移位的常见原因。石膏灌注过急会产生液流冲击使人工牙浮起，人工牙若未用蜡充分固定也易移位；分离剂涂布过厚主要影响石膏与蜡型分离，不会直接使人工牙浮起；蜡型表面残留分离剂影响的是石膏与蜡型贴合；石膏过稀强度降低但一般不单独导致人工牙浮起。","tier":"挑战"},{"id":299,"type":"single","stem":"铸造完成后，铸件从铸型中取出进行喷砂处理，下列对钴铬合金铸件喷砂操作的描述正确的是","options":["用氧化铝砂在适当压力下均匀喷射铸件表面","用石英砂高压集中喷射铸件表面","用玻璃珠在极低压力下反复喷射","用钢砂在高温下喷射铸件表面"],"answer":[0],"explanation":"知识点：钴铬合金铸件喷砂清理的磨料与压力选择。氧化铝砂硬度高、颗粒均匀，在适当压力下可有效清除铸件表面包埋料和氧化层而不损伤铸件；石英砂硬度不足且粉尘危害大；玻璃珠压力过低难以清除包埋料且效率低；钢砂会嵌入铸件表面并造成污染，高温操作无实际意义。","tier":"挑战"},{"id":300,"type":"multi","stem":"在制作可摘局部义齿时，关于模型设计中的填倒凹处理，下列说法正确的是","options":["填倒凹应填在基托覆盖区的软组织倒凹处","填倒凹应填在卡环臂进入倒凹区以外的区域","填倒凹可防止义齿戴入时压伤软组织","填倒凹是为了让卡环臂获得足够固位力","填倒凹应填在基牙的倒凹区以保证卡环固位"],"answer":[0,1,2],"explanation":"知识点：可摘局部义齿模型填倒凹的目的与部位。填倒凹填在基托覆盖区的软组织倒凹处和卡环臂进入倒凹区以外的区域，目的是防止义齿就位时压伤软组织并保证顺利就位；卡环臂的固位力来自其进入基牙倒凹区，因此基牙倒凹区不能填，填在基牙倒凹区会削弱固位，故该项错误。","tier":"挑战"}]}